UPC8131TA-E3 NEC [NEC], UPC8131TA-E3 Datasheet - Page 36

• Manufacturer Part Number: UPC8131TA-E3
• Description: -15 dBm INPUT, VARIABLE GAIN AMPLIFIER SILICON MMIC FOR TRANSMITTER AGC OF DIGITAL CELLULAR TELEPHONE
• Manufacturer: NEC [NEC]

NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All
(3) The bypass capacitor (eg. 1000 pF) should be attached to the V
(4) Impedance matching circuit must be each externally attached to input and output ports.
(5) The bias must be applied to output pin through the matching inductor. (The bias must not be applied to input
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
36
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
pin.)
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit
Note
: None
Note
Note
Note
Soldering Conditions
: None
: None
: None
CC
pin.
PC8130TA, PC8131TA
For soldering methods and
Recommended Condition
Symbol
WS60-00-1
VP15-00-3
IR35-00-3
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