CY7C1381D CYPRESS [Cypress Semiconductor], CY7C1381D Datasheet - Page 20

• Manufacturer Part Number: CY7C1381D
• Description: 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document #: 38-05544 Rev. *A
AC Test Loads and Waveforms
Thermal Resistance
Capacitance
Switching Characteristics
Θ
Θ
C
C
C
t
Clock
t
t
t
Output Times
t
t
t
t
t
t
t
Setup Times
t
Parameter
Parameter
3.3V I/O Test Load
POWER
CYC
CH
CL
CDV
DOH
CLZ
CHZ
OEV
OELZ
OEHZ
AS
Parameter
2.5V I/O Test Load
OUTPUT
OUTPUT
IN
CLK
I/O
JA
JC
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Z
Z
[18]
0
0
= 50Ω
= 50Ω
Description
Description
(a)
(a)
V
V
Clock Cycle Time
Clock HIGH
Clock LOW
Data Output Valid After CLK Rise
Data Output Hold After CLK Rise
Clock to Low-Z
Clock to High-Z
OE LOW to Output Valid
OE LOW to Output Low-Z
OE HIGH to Output High-Z
Address Set-up Before CLK Rise
V
[18]
T
T
DD
= 1.25V
= 1.5V
(Typical) to the first Access
R
R
L
L
= 50Ω
= 50Ω
Over the Operating Range
Test conditions follow standard
test methods and procedures
for measuring thermal
impedence, per EIA / JESD51.
OUTPUT
OUTPUT
[20, 21, 22]
T
V
V
Description
[20, 21, 22]
3.3V
2.5V
A
DD
DDQ
INCLUDING
= 25°C, f = 1 MHz,
INCLUDING
Test Conditions
Test Conditions
= 3.3V.
JIG AND
= 2.5V
JIG AND
SCOPE
SCOPE
5 pF
5 pF
PRELIMINARY
[20, 21, 22]
[20, 21, 22]
[19]
(b)
(b)
R = 317Ω
R = 1667Ω
[20, 21]
R = 351Ω
R =1538Ω
TQFP Package
TQFP Package BGA Package fBGA Package Unit
Min.
7.5
2.1
2.1
2.0
2.0
1.5
5
5
5
1
0
0
31
133 MHz
6
V
V
GND
GND
DDQ
DDQ
≤ 1ns
≤ 1ns
Max.
BGA Package
6.5
4.0
3.2
4.0
10%
10%
8
8
8
ALL INPUT PULSES
ALL INPUT PULSES
45
7
90%
90%
Min.
2.5
2.0
2.5
2.0
1.5
10
1
0
0
100 MHz
(c)
(c)
fBGA Package
CY7C1381D
CY7C1383D
Max.
8.5
5.0
3.8
5.0
9
9
9
46
3
Page 20 of 29
90%
90%
10%
10%
≤ 1ns
≤ 1ns
Unit
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
°C/W
°C/W
Unit
pF
pF
pF