SKY77149_06 SKYWORKS [Skyworks Solutions Inc.], SKY77149_06 Datasheet - Page 11

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SKY77149_06

Manufacturer Part Number
SKY77149_06
Description
PA Module for CDMA / PCS (1850-1910 MHz)
Manufacturer
SKYWORKS [Skyworks Solutions Inc.]
Datasheet
PA MODULE FOR CDMA / PCS (1850–1910 MHz)
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77149 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
Manufacture
Figure 13. SKY77149 Pin Names and Configuration (Top View)
Identifier
Package
Number
Year of
Sealed
VCONT
Week
RF_IN
Pin 1
VCC1
VREF
Pad layout as seen from top view looking through the package.
GROUND PAD is package underside.
Lot
103062B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 6, 2006
Figure 14. Typical Case Markings
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
1
2
4
3
YYWW MX
YYWW MX
77149-N
77149-N
XXXXX.X
XXXXX.X
GROUND PAD
6
5
8
7
GND
GND
RF_OUT
VCC2
Part
Number
Revision
Number
Country
Code
103062_014
103062_013
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77149 is a Class 2 device.
Discharge (ESD) immunity level for each non-ground pin of the
SKY77149 product. The numbers in
threshold level for each pin where the I-V curve between the pin
and ground starts to show degradation.
The ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely non-
functional”. Skyworks employs most stringent criteria and fails
devices as soon as the pin begins to show any degradation on a
curve tracer.
VCONT
> + 2 kV
< – 2 kV
> + 2 kV
< – 2 kV
RF_IN
> + 2 kV
< – 2 kV
> + 2 kV
< – 2 kV
VCC1
VREF
Pad layout as seen from top view looking through the package.
Pad layout as seen from top view looking through the package.
Figure 15. ESD Sensitivity Areas (Top View)
2
1
3
4
GROUND PAD
Figure 15
Figure 15
DATA SHEET • SKY77149
lists the Electrostatic
specify the ESD
8
7
6
5
GND
GND
RF_OUT
> + 2 kV
< – 2 kV
VCC2
> + 2 kV
< – 2 kV
103062_015
11

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