PCF8812U/2 PHILIPS [NXP Semiconductors], PCF8812U/2 Datasheet - Page 27

• Manufacturer Part Number: PCF8812U/2
• Description: 65 x 102 pixels matrix LCD driver
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
The required minimum value for the external capacitors in an application with the PCF8812 are as follows:
Higher capacitor values are recommended for ripple reduction.
18 CHIP INFORMATION
The PCF8812 is manufactured in n-well CMOS technology. The substrate is at V
19 PAD INFORMATION
Table 8 Bonding pad dimensions
2000 Nov 22
handbook, full pagewidth
Pad pitch
Pad size; aluminium
Bump dimensions
Wafer thickness; including bumps
Wafer thickness; without bumps
C
C
65
VLCD
VDD
; C
= 100 nF (minimum)
102 pixels matrix LCD driver
VDD1
; C
VDD2
= 1 F (minimum).
Fig.19 Application diagram; external high voltage generation is used.
NAME
32
4
(1)
I/O
V DD
DISPLAY 102
C VDD
PCF8812
27
70 m
62
50
maximum 430 m
381 m typ.
V SS V LCDIN
102
65
90
100 m
17.5 m ( 5)
reset
SS
DIMENSION
potential.
MGT649
33
Product specification
PCF8812