74LVC2G66DC PHILIPS [NXP Semiconductors], 74LVC2G66DC Datasheet - Page 18
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74LVC2G66DC
Manufacturer Part Number
74LVC2G66DC
Description
Bilateral switch
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1.74LVC2G66DC.pdf
(22 pages)
Philips Semiconductors
15. Package outline
Fig 23. Package outline TSSOP8.
9397 750 13259
Product data sheet
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT505-2
max.
1.1
A
0.15
0.00
A 1
8
1
0.95
0.75
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.38
0.22
b p
b p
5
0
0.18
0.08
4
JEDEC
c
- - -
w
REFERENCES
D
3.1
2.9
M
(1)
Rev. 01 — 29 June 2004
E
3.1
2.9
(1)
c
JEITA
scale
0.65
2.5
e
A
H E
4.1
3.9
A 2
A 1
0.5
L
H E
E
0.47
0.33
5 mm
detail X
L p
0.2
v
L
L p
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
EUROPEAN
0.13
w
A
(A 3 )
74LVC2G66
0.1
y
X
v
M
0.70
0.35
Z
A
(1)
Bilateral switch
ISSUE DATE
02-01-16
8
0
SOT505-2
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