STLC3055N_09 STMICROELECTRONICS [STMicroelectronics], STLC3055N_09 Datasheet - Page 32

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STLC3055N_09

Manufacturer Part Number
STLC3055N_09
Description
WLL and ISDN-TA subscriber line interface circuit
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package information
10
32/34
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 22. LQFP44 (10 x 10 x 1.4 mm) mechanical data and package dimensions
DIM.
ccc
A1
A2
D1
D3
E1
E3
L1
C
D
A
B
E
e
L
k
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
11.80
11.80
MIN.
0.05
1.35
0.30
0.09
9.80
9.80
0.45
12.00
10.00
12.00
10.00
TYP.
1.40
0.37
8.00
8.00
0.80
0.60
1.00
mm
0˚(min.), 3.5˚(typ.), 7˚(max.)
MAX.
12.20
10.20
12.20
10.20
1.60
0.15
1.45
0.45
0.20
0.75
0.10
0.002
0.053
0.012
0.004
0.464
0.386
0.464
0.386
0.018
MIN.
0.055
0.015
0.472
0.394
0.315
0.472
0.394
0.315
0.031
0.024
0.039
inch
TYP.
0.0039
MAX.
0.063
0.006
0.057
0.018
0.008
0.480
0.401
0.480
0.401
0.030
LQFP44 (10 x 10 x 1.4mm)
MECHANICAL DATA
OUTLINE AND
0076922 E
STLC3055N
®

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