TDA8002AT PHILIPS [NXP Semiconductors], TDA8002AT Datasheet - Page 14

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TDA8002AT

Manufacturer Part Number
TDA8002AT
Description
IC card interface
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet

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Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
Note
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 , 100 pF) 3 positive pulses and 3 negative pulses on each pin referenced to ground.
THERMAL CHARACTERISTICS
1997 Nov 04
V
V
V
V
T
P
T
T
R
stg
amb
j
DD
i(CMOS)
i(card)
es
tot
th(j-a)
IC card interface
SYMBOL
SYMBOL
operation of the device under this condition is not implied.
supply voltage
voltage on CMOS pins
voltage on card contact pins
electrostatic handling
storage temperature
continuous total power dissipation
operating ambient temperature
junction temperature
thermal resistance from junction to ambient in free air
XTAL1, XTAL2, ALARM, ALARM,
MODE, RSTIN, CLKSEL, AUX2UC,
AUX1UC, CLKDIV1, CLKDIV2,
CLKOUT, STROBE, CMDVCC and
OFF
I/O, AUX2, PRES, PRES, AUX1,
CLK, RST and V
on pins I/O, RST, V
AUX2, PRES and PRES
on all other pins
TDA8002T
TDA8002G
SOT136-1
SOT401-1
PARAMETER
CC
CC
, CLK, AUX1,
PARAMETER
T
T
14
amb
amb
= 25 to +85 C
= 25 to +85 C
CONDITIONS
0.3
0.3
0.3
6
2
55
25
MIN.
VALUE
70
91
+6.5
+6.5
+6.5
+6
+2
+125
0.56
0.46
+85
150
Product specification
MAX.
TDA8002
UNIT
K/W
K/W
V
V
V
kV
kV
W
W
C
C
C
UNIT

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