TDA8003TS/C1 PHILIPS [NXP Semiconductors], TDA8003TS/C1 Datasheet - Page 19

• Manufacturer Part Number: TDA8003TS/C1
• Description: I2C-bus SIM card interface
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
PACKAGE OUTLINE
2000 Apr 20
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
I
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
2
UNIT
mm
C-bus SIM card interface
OUTLINE
VERSION
SOT340-1
max.
2.0
A
24
1
Z
0.21
0.05
A
y
pin 1 index
1
1.80
1.65
A
2
IEC
0.25
A
3
e
D
0.38
0.25
b
p
0.20
0.09
MO-150
JEDEC
c
REFERENCES
b
D
8.4
8.0
p
0
(1)
13
12
E
5.4
5.2
w
(1)
M
scale
EIAJ
0.65
2.5
19
e
c
H
7.9
7.6
E
A
2
5 mm
1.25
L
A
1
1.03
0.63
L
p
H
E
E
0.9
0.7
detail X
Q
L
PROJECTION
EUROPEAN
L
0.2
p
v
Q
(A )
0.13
w
3
A
TDA8003TS
Product specification
0.1
A
y
ISSUE DATE
X
v
95-02-04
99-12-27
Z
0.8
0.4
M
(1)
SOT340-1
A
8
0
o
o