TDA8024TT PHILIPS [NXP Semiconductors], TDA8024TT Datasheet - Page 16

• Manufacturer Part Number: TDA8024TT
• Description: IC card interface
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
9
Notes
1. All card contacts are protected against any short-circuit with any other card contact.
2. Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
3. In accordance with EIA/JESD22-A114-B, June 2000.
4. In accordance with EIA/JESD22-A115-A, October 1997.
10 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take
normal precautions appropriate to handling MOS devices (see “Handling MOS devices” ).
11 THERMAL CHARACTERISTICS
Note
1. This figure was obtained using the following PCB technology: FR, 4 layers, 0.5 mm thickness, class 5, copper
2004 July 12
V
V
V
V
V
T
T
V
R
SYMBOL
SYMBOL
j(max)
stg
DD
DDP
I
card
n
esd
th(j-a)
IC card interface
, V
Method 3015 (HBM; 1500
thickness 35 m, Ni/Go plating, ground plane in internal layers
LIMITING VALUES
O
supply voltage
DC/DC converter supply voltage
voltage on input and output pins
voltage on card pins
voltage on other pins
maximum junction temperature
storage temperature
electrostatic discharge voltage
thermal resistance from junction
to ambient
TDA8024T
TDA8024AT
TDA8024TT
PARAMETER
PARAMETER
and 100 pF) 3 pulses positive and 3 pulses negative on each pin referenced to ground.
pins XTAL1, XTAL2, 5V/3V, RSTIN,
AUX1UC, AUX2UC, I/OUC,
CLKDIV1, CLKDIV2, CMDVCC, OFF
and PORADJ
pins PRES, PRES, I/O, RST, AUX1,
AUX2 and CLK
pins V
card contacts in typical application;
notes 1 and 2
all pins; note 1
in free air
pins I/O, RST, V
CLK, PRES and PRES
human body model; notes 2 and 3
machine model; note 4
UP
16
, S1 and S2
CONDITIONS
CONDITIONS
CC
, AUX1, AUX2,
0.3
0.3
0.3
0.3
0.3
55
6
2
200
MIN.
VALUE
100
70
70
(1)
Product specification
+6.5
+6.5
+6.5
+6.5
+6.5
150
+150
+6
+2
+200
MAX.
TDA8024
UNIT
K/W
K/W
K/W
V
V
V
V
V
kV
kV
V
C
C
UNIT