PCA9512AD ETC1 [List of Unclassifed Manufacturers], PCA9512AD Datasheet
PCA9512AD
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PCA9512AD Summary of contents
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PCA9512A Level shifting hot swappable I Rev. 01 — 7 October 2005 1. General description The PCA9512A is a hot swappable I insertion into a live backplane without corruption of the data and clock buses and includes two dedicated supply ...
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... Type number Topside Package mark Name PCA9512AD PA9512A SO8 PCA9512ADP 9512A TSSOP8 [1] Also known as MSOP8. Standard packing quantities and other packaging data are available at the Philips website. PCA9512A_1 Product data sheet Level shifting hot swappable I PCA9510A PCA9511A PCA9512A PCA9513A PCA9514A ...
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Philips Semiconductors 6. Block diagram PCA9512A V CC SLEW RATE ACC DETECTOR SDAIN CONNECT 100 k RCH1 100 k RCH2 SLEW RATE ACC DETECTOR SCLIN CONNECT 0.55V / CC 0.45V CC 100 s UVLO DELAY Fig 1. Block diagram of ...
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... V it will return to the undervoltage lock out CC CC2 Rev. 01 — 7 October 2005 PCA9512A 2 C-bus and SMBus bus buffer CC2 SCLOUT 2 7 PCA9512ADP SCLIN 3 6 GND 4 5 002aab790 Fig 3. Pin configuration for TSSOP8 2 C-buses. Connect pull-up resistors or V may rise first and either may be CC ...
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Philips Semiconductors STOP condition is seen on the SDAIN and SCLIN pins, the connect circuitry is activated, connecting SDAIN to SDAOUT and SCLIN to SCLOUT. The 1 V precharge circuitry is disabled when the connection is made, unless the ACC ...
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Philips Semiconductors The PCA9510A (rise time accelerator is permanently disabled) and the PCA9512A (rise time accelerator can be turned off) are a little different with the rise time accelerator turned off because the rise time accelerator will not pull the ...
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Philips Semiconductors rate is slow enough that the output catches up it will still lag the falling voltage of the input by the offset voltage. The maximum t delay and the output is still limited by its turn-on delay and ...
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Philips Semiconductors max 20 rise time > 300 ns 10 recommended pull- 100 200 Fig 5. Bus requirements for 3.3 V systems 8.8 Hot swapping and capacitance buffering application ...
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Philips Semiconductors BACKPLANE CONNECTOR BACKPLANE V CC2 BD_SEL V CC SDA SCL Remark: Application assumes bus capacitance within ‘proper operation’ region of Fig 7. Hot swapping multiple I/O cards into a backplane using the ...
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Philips Semiconductors BACKPLANE CONNECTOR BACKPLANE V CC2 V CC SDA SCL Remark: Application assumes bus capacitance within ‘proper operation’ region of Fig 8. Hot swapping multiple I/O cards into a backplane using the PCA9512A ...
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Philips Semiconductors 9. Application design-in information SDA SCL Fig 10. Typical application 10. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ...
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Philips Semiconductors 11. Characteristics Table 5: Characteristics +85 C; unless otherwise specified. CC amb Symbol Parameter Power supply V supply voltage CC [2] V supply voltage 2 CC2 ...
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Philips Semiconductors Table 5: Characteristics …continued +85 C; unless otherwise specified. CC amb Symbol Parameter System characteristics f SCL clock frequency SCL t bus free time between BUF ...
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Philips Semiconductors 11.1 Typical performance characteristics 2. (mA 5 3.3 V 1.95 2.7 V 1.75 1.55 1.35 40 +25 I (pin 1) typical current averages 0.1 mA less CC2 than I on pin 8. ...
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Philips Semiconductors 12. Test information R = load resistor load capacitance includes jig and probe capacitance termination resistance should be equal to the output impedance Z T Fig 15. Test circuitry for switching times ...
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Philips Semiconductors 13. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 17. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...