DAC667JP BURR-BROWN [Burr-Brown Corporation], DAC667JP Datasheet - Page 3

• Manufacturer Part Number: DAC667JP
• Description: Microprocessor-Compatible 12-BIT DIGITAL-TO-ANALOG CONVERTER
• Manufacturer: BURR-BROWN [Burr-Brown Corporation]

PACKAGE/ORDERING INFORMATION
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
TIMING SPECIFICATIONS
TIMING DIAGRAMS
PRODUCT
DAC667JP
V
V
Digital Inputs (Pins 11–15, 17–28) to Power Ground ............. –1V to +7V
Ref In to Reference Ground .............................................................. 12V
Bipolar Offset to Reference Ground ................................................. 12V
10V Span Resistor to Reference Ground ......................................... 12V
20V Span Resistor to Reference Ground ......................................... 24V
Ref Out, V
Power Dissipation ........................................................................ 1000mW
SYMBOL
t
t
t
t
t
All models, T
DC
AC
CP
DH
SETT
CC
EE
Load first rank from Data Bus; A3 = 1.
Write Cycle #1
DB11–DB0
A2–A0
CS
to Power Ground .............................................................. 0V to +18V
to Power Ground .............................................................. 0V to –18V
OUT
PARAMETER
Data Valid to End of CS
Address Valid to End of CS
CS Pulse Width
Data Hold Time
Output Voltage Settling Time
A
= +25 C, V
(Pins 6, 9) .................... Indefinite Short to Power Ground,
28-Pin Plastic DIP
PACKAGE
CC
= +12V or +15V, V
t
t
AC
t
DC
t
CP
MIN
100
100
EE
50
Momentary Short To V
0
–
TEMPERATURE
= –12V or –15V.
0 C to +70 C
TYP
RANGE
–
–
–
–
2
t
MAX UNITS
DH
–
–
–
–
4
ns
ns
ns
ns
s
CC
LINEARITY ERROR
3
max at 25 C
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
1/2LSB
Load second rank from first rank; A2, A1, A0 = 1.
A3
Write Cycle #2
CS
Output
ELECTROSTATIC
DISCHARGE SENSITIVITY
GAIN TC, max
(ppm/ C)
30
t
AC
t
CP
DAC667
t
SETT
PACKAGE DRAWING
NUMBER
215
±1/2LSB
(1)
®