ADSP-21262_05 AD [Analog Devices], ADSP-21262_05 Datasheet - Page 45

• Manufacturer Part Number: ADSP-21262_05
• Description: Embedded Processor
• Manufacturer: AD [Analog Devices]

PACKAGE DIMENSIONS
The ADSP-21262 is available in a 136-ball BGA package and a
144-lead LQFP package shown in
0.08 MAX (LEAD
COPLANARITY)
0.75
0.60 TYP
0.45
0.27
0.22
0.17
SEATING
PLANE
TYP
0.15
0.05
MAX
1.70
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
4. CENTER DIMENSIONS ARE NOMINAL.
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
THE BALL DIAMETER.
DETAIL A
1.60 MAX
PIN A1 INDICATOR
1.45
1.40
1.35
12.00 BSC SQ
TOP VIEW
Figure 35
0.50
BSC
TYP
(LEAD
PITCH)
and
Figure
Rev. B | Page 45 of 48 | August 2005
Figure 35. 136-Ball BGA (BC-136-3)
DETAIL A
3 6
1
DETAIL A
144
36.
Figure 36. 144-Lead LQFP (ST-144-2)
37
PIN 1 INDICATOR
BSC
BSC
0.80
0.80
TYP
TYP
TOP VIEW (PINS DOWN)
22.00 BSC SQ
A
B
C
D
G
H
K
M
N
E
F
J
L
P
14
13
12
0.25
MIN
20.00 BSC SQ
11
10 9 8 7 6 5 4 3 2 1
10.40 BSC SQ
BOTTOM VIEW
DIAMETER)
(BALL
0.50
0.45
0.40
DETAIL A
109
72
108
73
1. DIMENSIONS ARE IN MILLIMETERS
2. ACTUAL POSITION OF EACH LEAD
3. CENTER DIMENSIONS ARE NOMINAL.
AND COMPLY WITH JEDEC
STANDARD MS-026-BFB.
IS WITHIN 0.08 OF ITS IDEAL POSITION
WHEN MEASURED IN THE LATERAL
DIRECTION.
0.12 MAX (BALL
COPLANARITY)
BSC
0.80
TYP
SEATING
PLANE
ADSP-21262