STPC0310BTI3 STMICROELECTRONICS [STMicroelectronics], STPC0310BTI3 Datasheet - Page 46

• Manufacturer Part Number: STPC0310BTI3
• Description: PC Compatible Embeded Microprocessor
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

BOARD LAYOUT
A local ground plane on opposite side of the board
as shown in Figure 6-6 improves thermal dissipa-
tion. It is used to connect decoupling capacitances
but can also be used for connection to a heat sink
or to the system’s metal box for better dissipation.
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Figure 6-6. Bottom side layout and decoupling
Figure 6-7. Use of metal plate for thermal dissipation
Metal planes
Issue 1.2
Die
This possibility of using the whole system’s box for
thermal dissipation is very usefull in case of high
temperature inside the system and low tempera-
ture outside. In that case, both sides of the PBGA
should be thermally connected to the metal chas-
sis in order to propagate the heat through the met-
al. Figure 6-7 illustrates such an implementation.
Ground plane for thermal dissipation
Via to ground layer
Thermal conductor
Board