TP3054WMX NSC [National Semiconductor], TP3054WMX Datasheet - Page 2

• Manufacturer Part Number: TP3054WMX
• Description: Engineering Project Manager
• Manufacturer: NSC [National Semiconductor]

National Semiconductor
Device
* Cd: Cadmium, CrVI: Hexavalent Chromium, Pb: Lead, Hg: Mercury, ND: Not Detected
* Unless otherwise noted, units are in PPM (parts-per-million)
Use
Ref #
Contains Lead(Pb) and is NOT European RoHS Compliant.
1000
564
32
51
56
75
TP3054WMX
Material
CHIP
COMPOUND
EPOXY
EXTLF
FRAME
WIRE
3rd Party Analysis (available upon request, subject to a non-disclosure agreement)
Analysis on 04/17/2007 by Balazs Analytical Services-Freemont CA per Report# 07-01051-07
Analysis on 05/16/2007 by ALS per Report# ATJB/3488BS/2007
Analysis on 03/13/2007 by SGS per Report# LPCI/05141/07
Analysis on 04/27/2007 by SGS per Report# LPCI/07440/07
Analysis on 05/16/2007 by ALS per Report# ATJB/3490BS/2007
Analysis on 04/27/2007 by SGS per Report# LPCI/07426/07
Part Number
Cd
<1
<2
<2
<2
<2
<2
Banned Substance Monitoring
CrVl
Document Date
<1
<2
<5
<2
<2
<5
1-Sep-2007
149000
Pb
<1
<2
<5
<2
<5
Hg
<1
<2
<1
<2
<2
<1
NOT China RoHS Compliant
PBB
<100
<10
<10
NA
NA
<1
PBDE
<100
<10
<10
NA
NA
<1
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Ref #
1000
564
32
56
51
75