MCP2003T-E/P MICROCHIP [Microchip Technology], MCP2003T-E/P Datasheet - Page 15
![no-image](/images/no-image-200.jpg)
MCP2003T-E/P
Manufacturer Part Number
MCP2003T-E/P
Description
LIN J2602 Transceiver
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
1.MCP2003T-EP.pdf
(32 pages)
- Current page: 15 of 32
- Download datasheet (407Kb)
2.4
2010 Microchip Technology Inc.
THERMAL CHARACTERISTICS
Recovery Temperature
Shutdown Temperature
Short Circuit Recovery Time
Thermal Package Resistances
Thermal Resistance, 8L-DFN
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Note 1:
Thermal Specifications
The maximum power dissipation is a function of T
allowable power dissipation at an ambient temperature is P
exceeded, the die temperature will rise above 150C and the MCP2003/4 will go into thermal shutdown.
Parameter
SHUTDOWN
RECOVERY
Symbol
t
THERM
JA
JA
JA
149.5
+140
+150
35.7
89.3
Typ
1.5
JMAX
Max
5.0
,
—
—
—
—
—
JA
D
and ambient temperature T
= (T
Units
C/W
C/W
C/W
ms
C
C
JMAX
- T
A
)
MCP2003/4
JA
. If this dissipation is
Test Conditions
A
DS22230A-page 15
. The maximum
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