AD8139 AD [Analog Devices], AD8139 Datasheet - Page 24
![no-image](/images/no-image-200.jpg)
AD8139
Manufacturer Part Number
AD8139
Description
Low Noise Rail-to-Rail Differential ADC Driver
Manufacturer
AD [Analog Devices]
Datasheet
1.AD8139.pdf
(24 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD8139ACPZ
Manufacturer:
ADI
Quantity:
260
Company:
Part Number:
AD8139ACPZ
Manufacturer:
M/A-COM
Quantity:
5 000
Part Number:
AD8139ACPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8139ACPZ-R2
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
AD8139ACPZ-REEL7
Manufacturer:
AD
Quantity:
3
Part Number:
AD8139ACPZ-REEL7
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8139AR
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD8139ARD
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD8139
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD8139ARD
AD8139ARD-REEL
AD8139ARD-REEL7
AD8139ARDZ
AD8139ARDZ-REEL
AD8139ARDZ-REEL7
AD8139ACP-R2
AD8139ACP-REEL
AD8139ACP-REEL7
AD8139ACPZ-R2
AD8139ACPZ-REEL
AD8139ACPZ-REEL7
1
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis-
tered trademarks are the property of their respective owners.
Z = Pb-free part.
Figure 63. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC/EP], Narrow Body (RD-8-1)—Dimensions shown in millimeters and (inches)
1
1
Figure 64. 8-Lead Lead Frame Chip Scale Package [LFCSP], 3 mm × 3 mm Body (CP-8-2)—Dimensions shown in millimeters
1
1
1
1
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
INDICATOR
SEATING
0.90
0.85
0.80
PLANE
PIN 1
COPLANARITY
12° MAX
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
0.25 (0.0098)
0.10 (0.0039)
D04679–0–8/04(A)
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
BSC SQ
0.30
0.23
0.18
VIEW
3.00
TOP
0.80 MAX
0.65 TYP
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-012
8-Lead Small Outline Package (SOIC)
Package Description
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Small Outline Package (SOIC)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
5.00 (0.197)
4.90 (0.193)
4.80 (0.189)
8
TOP VIEW
1
1.27 (0.05)
BSC
BSC SQ
0.20 REF
2.75
Rev. A | Page 24 of 24
5
4
0.51 (0.020)
0.31 (0.012)
0.05 MAX
0.02 NOM
6.20 (0.244)
6.00 (0.236)
5.80 (0.228)
1.75 (0.069)
1.35 (0.053)
0.45
BSC
0.50
0.25 (0.0098)
0.17 (0.0068)
0.25
MIN
0.60 MAX
BOTTOM VIEW
8
5
(BOTTOM VIEW)
EXPOSED
(PINS UP)
PAD
8°
0°
0.50 (0.020)
0.25 (0.010)
1.27 (0.050)
0.40 (0.016)
2.29 (0.092)
4
0.50
0.40
0.30
1.60
1.45
1.30
1
2.29 (0.092)
1.50
REF
× 45°
PIN 1
INDICATOR
1.90
1.75
1.60
Package Option
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
RD-8-1
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
Branding
HEB
HEB
HEB
HEB
HEB
HEB