CP211 CENTRAL [Central Semiconductor Corp], CP211 Datasheet
CP211
Manufacturer Part Number
CP211
Description
Power Transistor NPN - Amp/Switch Transistor Chip
Manufacturer
CENTRAL [Central Semiconductor Corp]
Datasheet
1.CP211.pdf
(2 pages)
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PROCESS
Power Transistor
NPN - Amp/Switch Transistor Chip
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
GEOMETRY
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
BACKSIDE COLLECTOR
EPITAXIAL BASE
80 x 99 MILS
12.5 MILS
12 x 32 MILS
13 x 48 MILS
Al - 30,000Å
Cr/Ni/Ag 16,000Å
GROSS DIE PER 4 INCH WAFER
PRINCIPAL DEVICE TYPES
1,450
2N3054A
CJD41C
TIP41C
Central
Semiconductor Corp.
R3 (21-September 2003)
TM
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CP211 Summary of contents
Page 1
PROCESS Power Transistor NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788 USA Tel: ...
Page 2
Central Central TM TM Semiconductor Corp. Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS Typical Electrical Characteristics R3 (21-September 2003) ...