MCZ1210-T TDK [TDK Electronics], MCZ1210-T Datasheet

MCZ1210-T

Manufacturer Part Number

MCZ1210-T

Description

Chip Beads(SMD Array) For Audio Signal Line

Manufacturer

TDK [TDK Electronics]

Datasheet

1.MCZ1210-T.pdf (2 pages)

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Chip Beads(SMD Array)

For Audio Signal Line

MCZ Series MCZ1210-T Type(3-Line)

This is a common type bead product that removes the noise

components in a signal line and includes beads for three lines in a

single chip. The product exhibits substantial impedance character-

istics in the high frequency range and is therefore capable of effec-

tively removing differential mode noises.

Additionally, an appropriate amount of magnetic coupling is creat-

ed between the beads of the three lines, giving the product the

capability to remove not only differential mode noise but common

mode noise as well. It is encased in a 1210 casing. This is an SMD

product that allows for automatic mounting by taping.

FEATURES

• Compact size and for three lines

• Capable of removing both common and differential mode noises.

• Closed magnetic circuit structure allows high-density installation

APPLICATIONS

Audio signal lines used in cell phones and mobile audio devices.

PRODUCT IDENTIFICATION

(1) Series name

(2) Dimensions L× W

(3) Material code

(4) Number of line

(5) Impedance

(6) Packaging style

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

• Please contact our Sales office when your application are considered the following:

• All specifications are subject to change without notice.

MCZ 1210 C

(1)

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

while preventing crosstalk between circuits.

201: 200Ω at 100MHz

T:Taping

(2)

(3) (4) (5) (6)

T 201 T

SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD

PATTERN

CIRCUIT DIAGRAM

TEMPERATURE RANGES

Operating/Storage

PACKAGING STYLE AND QUANTITIES

Packaging style

Taping

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components. The preheat-

• After mounting components onto the printed circuit board, do not

• The inductance value may change due to magnetic saturation if

• Do not expose the inductors to stray magnetic fields.

• Avoid static electricity discharge during handling.

• When hand soldering, apply the soldering iron to the printed cir-

0.225±0.1

• No polarity

ing temperature should be set so that the temperature difference

between the solder temperature and product temperature does

not exceed 150°C.

apply stress through board bending or mishandling.

the current exceeds the rated maximum.

cuit board only. Temperature of the iron tip should not exceed

350°C. Soldering time should not exceed 3 seconds.

0.475±0.1

1.25±0.1

–40 to +85°C

Quantity

4000 pieces/reel

001-05 / 20061022 / e9421_mcz1210_3.fm

Dimensions in mm

Conformity to RoHS Directive

0.225

0.25

(1/2)

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MCZ1210-T Summary of contents

Page 1

... Chip Beads(SMD Array) For Audio Signal Line MCZ Series MCZ1210-T Type(3-Line) This is a common type bead product that removes the noise components in a signal line and includes beads for three lines in a single chip. The product exhibits substantial impedance character- istics in the high frequency range and is therefore capable of effec- tively removing differential mode noises ...

Page 2

... Dimensions in mm Drawing direction Rated voltage Rated current Thickness T (V)max. (mA)max. (mm) 5 100 0.5 5 100 0.5 Open mode Common mode 10 100 1000 10000 Frequency ( MHz ) +0.1 Sprocket hole 1.5 Cavity –0.0 1.2±0.1 4.0±0.1 4.0±0.1 2.0±0.1 Taping 100min. Dimensions in mm 001-05 / 20061022 / e9421_mcz1210_3.fm (2/2) 250min. ...

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