ADV3003-EVALZ AD [Analog Devices], ADV3003-EVALZ Datasheet - Page 4

• Manufacturer Part Number: ADV3003-EVALZ
• Description: HDMI/DVI TMDS Equalizer
• Manufacturer: AD [Analog Devices]

ADV3003
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
AVCC to AVEE
VTTI
VTTO
Internal Power Dissipation
High Speed Input Voltage
High Speed Differential Input Voltage
Parallel Interface (TX_EN, PE_EN)
Storage Temperature Range
Operating Temperature Range
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
3.7 V
AVCC + 0.6 V
AVCC + 0.6 V
AVCC − 1.4 V < V
AVCC + 0.6 V
2.0 V
AVEE − 0.3 V < V
AVCC + 0.6 V
−65°C to +125°C
−40°C to +85°C
150°C
2.0 W
IN
IN
<
<
Rev. 0 | Page 4 of 16
THERMAL RESISTANCE
θ
soldered in a 4-layer JEDEC circuit board for surface-mount
packages.
circuit board with no airflow.
Table 3.
Package Type
40-Lead LFCSP
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the ADV3003
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can result
in device failure. To ensure proper operation, it is necessary to
observe the maximum power derating as determined by the
thermal resistance coefficients.
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
JC
is specified for the exposed pad soldered to the
θ
31.9
JA
θ
2.6
JC
Unit
°C/W