TS4855_04 STMICROELECTRONICS [STMicroelectronics], TS4855_04 Datasheet

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TS4855_04

Manufacturer Part Number
TS4855_04
Description
LOUDSPEAKER & HEADSET DRIVER WITH VOLUME CONTROL
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
DESCRIPTION
The TS4855 is a complete low power audio
amplifier solution targeted at mobile phones. It
integrates, into an extremely compact flip-chip
package, an audio amplifier, a speaker driver, and
a headset driver.
The Audio Power Amplifier can deliver 1.1 W
(typ.) of continuous RMS output power into an 8
speaker with a 1% THD+N value. To the headset
driver, the amplifier can deliver 85 mW (typ.) per
channel of continuous average power into stereo
32
This device features a 32-step digital volume
control and 8 different output selections. The
digital volume and output modes are controlled
through a three-digit SPI interface bus.
APPLICATIONS
ORDER CODE
J = Flip Chip Package - only available in Tape & Reel (JT))
TS4855IJT
TS4855EIJT
March 2004
Part Number
OPERATING FROM V
SPEAKER: Mono, THD+N @ 1 kHz is 1%
Max @ 1 W into 8
HEADSET: Stereo, THD+N @ 1 kHz is 0.5%
Max. @ 85 mW into 32
VOLUME CONTROL: 32-step digital
volume control
OUTPUT MODE: Eight different selections
Ultra low pop-and-click
Low Shutdown Current (0.1 µA, typ.)
Thermal Shutdown Protection
FLIP-CHIP Package 18 X 300 µm Bumps
TS4855E IJT Lead-Free option available
Mobile Phones
bridged-tied load with 0.5% THD+N @ 5 V.
Temperature
-40, +85°C
-40, +85°C
Range
BTL
CC
= 3.0 V to 5.0 V
BTL
Package
LOUDSPEAKER & HEADSET DRIVER
J
PIN CONNECTIONS (top view)
WITH VOLUME CONTROL
TS4855IJT - Flip Chip
Pin Out (top view)
TS4855
1/27

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TS4855_04 Summary of contents

Page 1

OPERATING FROM SPEAKER: Mono, THD kHz is 1% Max @ 1 W into 8 BTL HEADSET: Stereo, THD kHz is 0.5% Max into 32 VOLUME ...

Page 2

TS4855 1 APPLICATION INFORMATION FOR A TYPICAL APPLICATION External component descriptions Component This is the input coupling capacitor. It blocks the DC voltage at, and couples the input signal to the C amplifier’s input terminals. Cin also creates a highpass ...

Page 3

SPI Bus Interface 2 SPI BUS INTERFACE 2.1 Pin Descriptions Pin DATA This is the serial data input pin CLK This is the clock input pin ENB This is the SPI enable pin active at high level 2.2 SPI Operation ...

Page 4

TS4855 G2: Gain (dB) G1: Gain (dB) -34.5 -40.5 -33.0 -39.0 -31.5 -37.5 -30.0 -36.0 -28.5 -34.5 -27.0 -33.0 -25.5 -31.5 -24.0 -30.0 -22.5 -28.5 -21.0 -27.0 -19.5 -25.5 -18.0 -24.0 -16.5 -22.5 -15.0 -21.0 -13.5 -19.5 -12.0 -18.0 -10.5 ...

Page 5

Absolute Maximum Ratings 2.3 SPI Timing Diagram 3 ABSOLUTE MAXIMUM RATINGS Symbol V 1 Supply voltage CC T Operating Free Air Temperature Range oper T Storage Temperature stg T Maximum Junction Temperature j R Flip Chip Thermal Resistance Junction to ...

Page 6

TS4855 5 ELECTRICAL CHARACTERISTICS Table 4: Electrical characteristics at VCC = +5.0 V, GND = 0 V, Tamb = 25°C Symbol I Supply Current, all gain @ max settings CC Output Mode 1, Vin = load Output ...

Page 7

Electrical Characteristics Table 4: Electrical characteristics at VCC = +5.0 V, GND = 0 V, Tamb = 25°C Symbol Phone In Volume BTL maximum GAIN from Phone BTL minimum GAIN from Phone ...

Page 8

TS4855 Table 5: Electrical characteristics at VCC = +3.0 V, GND = 0 V, Tamb = 25°C Symbol Po Output Power SPKR , out R & out out THD + N Total ...

Page 9

Electrical Characteristics Table 5: Electrical characteristics at VCC = +3.0 V, GND = 0 V, Tamb = 25°C Symbol tds Data Setup Time- DATA tdh Data Hold Time - DATA tcs Clock Setup time - CLK tch Clock Logic High ...

Page 10

TS4855 Figure 1: Spkout THD+N vs. output power (Output modes < 125kHz Vcc=5V Tamb = 25 C F=20kHz Vcc=3V F=20kHz 1 0.1 Vcc=3V F=1kHz 1E-3 0.01 0.1 Output Power (W) Figure ...

Page 11

Electrical Characteristics Figure 7: HDout THD+N vs. output power (Output modes 2, 3 G=+3dB < 125kHz Tamb = 25 C Vcc=5V F=20kHz 1 Vcc=3V F=20kHz 0.1 Vcc=3V F=1kHz 0.01 1E-3 0.01 Output Power (W) Figure ...

Page 12

TS4855 Figure 13: Spkout THD+N vs. frequency (Output modes < 125kHz Tamb = Vcc=5V Vcc=3V P=800mW P=250mW 0.1 100 1000 Frequency (Hz) Figure 14: Spout THD+N vs. frequency ...

Page 13

Electrical Characteristics Figure 19: Speaker output power vs. power supply voltage (Output modes 2 1kHz 1.8 BW < 125kHz Tamb = 25 C 1.6 4 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 2.5 ...

Page 14

TS4855 Figure 25: Headphone output power vs. load resistance (Output modes 350 300 250 200 150 THD+N=1% 100 Load Resistance (Ohm) Figure 26: Headphone output power vs. ...

Page 15

Electrical Characteristics Figure 31: HDout PSRR vs. frequency (Output modes 4, 5 inputs grounded) 0 Output mode 4, 5 -10 Vcc=+ Vripple=0.2Vpp -20 Tamb = 25 C -30 -40 G=+6dB G=+12dB -50 G=+9dB -60 100 1000 Frequency ...

Page 16

TS4855 Figure 37: HDout frequency response (Output modes 2, 3 G=+6dB Vcc=5V Vcc= 100 1000 Frequency (Hz) Figure 38: HDout frequency response (Output modes 4, 5 G=+12dB Vcc=5V Vcc=3V 8 ...

Page 17

Electrical Characteristics Figure 43: Spkout SNR vs. power supply voltage, unweighted filter kHz 110 Vcc = 3V 108 Vcc = 5V RL=8 106 Unweighted filter (20Hz to 20kHz) 104 THD + N < 0.7% ...

Page 18

TS4855 Figure 49: HDout SNR vs. power supply voltage, unweighted filter kHz) 100 98 Vcc = 3V Vcc = G=+6dB and +12dB Unweighted filter (20Hz to 20kHz) 92 ...

Page 19

Electrical Characteristics Figure 55: Power dissipation vs. output power. headphone output one channel 120 Vcc=3V F=1kHz 100 THD+N< RL= Output Power (mW) RL= TS4855 19/27 ...

Page 20

TS4855 6 APPLICATION INFORMATION 6.1 BTL Configuration Principle The TS4855 integrates 3 monolithic power amplifiers having BTL output. BTL (Bridge Tied Load) means that each end of the load is connected to two single-ended output amplifiers. Thus, we have: Single ...

Page 21

Application Information The following graph shows an example of the previous formula, with Vcc R set to 8 and R load speaker 16 . Figure 56: Example of total power dissipation vs. speaker and headphone output power 1.2 1.0 0.8 ...

Page 22

TS4855 6.6 Pop and Click performance The TS4855 has internal Pop and Click reduction circuitry. The performance of this circuitry is closely linked with the value of the input capacitor Cin and the bias voltage bypass capacitor Cb. The value ...

Page 23

Application Information Figure 58: TS4855 Footprint Recommendation TS4855 23/27 ...

Page 24

TS4855 7 PACKAGE INFORMATION Flip-chip package—18 bumps: TS4855IJT Marking (on top view) Package mechanical data 2440µm 2440µm 750µm 750µm 500µm 500µm 866µm 866µm 866µm 866µm 24/27 ST LOGO Part number: B55 Three digit Datecode: YWW The dot is for marking ...

Page 25

Package Information Pin out (top view OUT- OUT- OUT- OUT PHONE PHONE PHONE PHONE BYPASS BYPASS BYPASS BYPASS ...

Page 26

TS4855 Daisy chain mechanical data All drawings dimensions are in millimeters OUT- OUT- OUT- OUT- OUT ...

Page 27

Tape & Reel Specification 8 TAPE & REEL SPECIFICATION Device orientation The devices are oriented in the carrier pocket with bump number A1 adjacent to the sprocket holes. Information furnished is believed to be accurate and ...

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