OPA600BM BURR-BROWN [Burr-Brown Corporation], OPA600BM Datasheet - Page 5

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OPA600BM

Manufacturer Part Number
OPA600BM
Description
Fast-Settling Wideband OPERATIONAL AMPLIFIER
Manufacturer
BURR-BROWN [Burr-Brown Corporation]
Datasheet

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TYPICAL PERFORMANCE CURVES
INSTALLATION
AND OPERATION
WIRING PRECAUTIONS
The OPA600 is a wideband, high frequency operational
amplifier with a gain-bandwidth product exceeding 5GHz.
This capability can be realized by observing a few wiring
precautions and using high frequency layout techniques. In
general, all printed circuit board conductors should be wide
to provide low resistance, low impedance signal paths and
should be as short as possible. The entire physical circuit
should be as small as is practical. Stray capacitances should
be minimized, especially at high impedance nodes, such as
the input terminals of the amplifier and compensation pins.
Stray signal coupling from the output to the input should be
minimized. All circuit element leads should be as short as
possible and low values of resistance should be used. This
will give the best circuit performance as it will minimize the
time constants formed with the circuit capacitances and will
eliminate stray, unwanted tuned circuits.
Grounding is the most important application consideration
for the OPA600, as it is with all high frequency circuits.
Ultra-high frequency transistors are used in the design of the
OPA600 and oscillations at frequencies of 500MHz and
above can be stimulated if good grounding techniques are
not used. A ground plane is highly recommended. It should
connect all areas of the pattern side of the printed circuit that
are not otherwise used. The ground plane provides a low
resistance, low inductance common return path for all signal
and power returns. The ground plane also reduces stray
signal pickup.
Point-to-point wiring is not recommended. However, if
point-to-point wiring is used, a single-point ground should
Typical at T
1.2
1.1
1.0
0.9
0.8
–75
A
I
Q
= +25 C, V
–50
OPEN-LOOP GAIN AND QUIESCENT
–25
CURRENT vs TEMPERATURE
CC
= 15VDC unless otherwise specified.
Temperature (°C)
0
25
50
A
VS
75
100
I
Q
125
be used. The input signal return, the load signal return and
the power supply common should all be connected at the
same physical point. This eliminates common current paths
or ground loops which can cause unwanted feedback.
Each power supply lead should be bypassed to ground as
near as possible to the amplifier pins. A 1 F CS13 tantalum
capacitor is recommended. A parallel 0.01 F ceramic may
be added if desired. This is especially important when
driving high current loads. Properly bypassed and modula-
tion-free power supply lines allow full amplifier output and
optimum settling time performance.
OPA600 circuit common is connected to pins 1 and 13; these
pins should be connected to the ground plane. The input
signal return, load return, and power supply common should
also be connected to the ground plane.
The case of the OPA600 is internally connected to circuit
common, and as indicated above, pins 1 and 13 should be
connected to the ground plane. Ideally, the case should be
mechanically connected to the ground plane for good ther-
mal transfer, but because this is difficult in practice, the
OPA600 should be fully inserted into the printed circuit
board with the case very close to the ground plane to make
the best possible thermal connection. If the case and ground
plane are physically connected or are in close thermal
proximity, the ground plane will provide heat sinking which
will reduce the case temperature rise. The minimum OPA600
pin length will minimize lead inductance, thereby maximiz-
ing performance.
(CONT)
1.4
1.2
1.0
0.8
0.6
–75
–50
–25
0
Temperature (°C)
BANDWIDTH
25
50
75
G = –10V/V
100
125

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