LM22672MR-5.0 NSC [National Semiconductor], LM22672MR-5.0 Datasheet - Page 13
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LM22672MR-5.0
Manufacturer Part Number
LM22672MR-5.0
Description
Manufacturer
NSC [National Semiconductor]
Datasheet
1.LM22672MR-5.0.pdf
(18 pages)
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the maximum output current and maximum input voltage can
be appreciable. The junction-to-ambient thermal resistance of
the LM22672 will vary with the application. The most signifi-
cant variables are the area of copper in the PC board, the
number of vias under the IC exposed pad and the amount of
forced air cooling provided. The integrity of the solder con-
13
nection from the IC exposed pad to the PC board is critical.
Excessive voids will greatly diminish the thermal dissipation
capacity. The junction-to-ambient thermal resistance of the
LM22672 PSOP-8 package is specified in the electrical char-
acteristics table under the applicable conditions.
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