ADCMP563BCP-R2 AD [Analog Devices], ADCMP563BCP-R2 Datasheet - Page 14

• Manufacturer Part Number: ADCMP563BCP-R2
• Description: Dual, High Speed ECL Comparators
• Manufacturer: AD [Analog Devices]

ADCMP563/ADCMP564
OUTLINE DIMENSIONS
COPLANARITY
ORDERING GUIDE
Model
ADCMP563BRQ
ADCMP563BRQZ
ADCMP563BCP-R2
ADCMP563BCP-RL7
ADCMP563BCP-WP
EVAL-ADCMP563BRQ
ADCMP564BRQ
ADCMP564BRQZ
EVAL-ADCMP564BRQ
1
0.010
0.004
Z = Pb-free part.
0.065
0.049
0.004
Figure 28. 16-Lead Shrink Small Outline Package [QSOP]
16
1
PIN 1
0.025
BSC
COMPLIANT TO JEDEC STANDARDS MO-137-AB
1
1
0.193
BSC
Dimensions shown in inches
0.012
0.008
INDICATOR
SEATING
9
8
PLANE
0.90
0.85
0.80
SEATING
PLANE
(RQ-16)
PIN 1
0.154
0.069
0.053
BSC
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
12° MAX
0.236
BSC
BSC SQ
0.010
0.006
0.30
0.23
0.18
VIEW
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3.00
TOP
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
8°
0°
3 mm × 3 mm Body, Very Thin Quad
Dimensions shown in millimeters
BSC SQ
0.20 REF
2.75
0.80 MAX
0.65 TYP
0.050
0.016
0.05 MAX
0.02 NOM
Rev. B | Page 14 of 16
Package Description
16-Lead QSOP
16-Lead QSOP
16-Lead LFCSP_VQ, 250 Unit Reel
16-Lead LFCSP_VQ, 1,500 Unit Reel
16-Lead LFCSP_VQ, 50 Unit Waffle Pack
Evaluation Board
20-Lead QSOP
20-Lead QSOP
Evaluation Board
(CP-16-3)
0.45
BSC
0.50
1.50 REF
COPLANARITY
0.60 MAX
0.010
0.004
PIN 1
0.004
12
9
Figure 29. 20-Lead Shrink Small Outline Package [QSOP]
13
(BOTTOM VIEW)
8
EXPOSED
20
0.065
0.049
1
PAD
COMPLIANT TO JEDEC STANDARDS MO-137-AD
0.025
BSC
16
5
1
4
0.50
0.40
0.30
Dimensions shown in inches
0.341
BSC
0.012
0.008
0.25 MIN
* 1.65
1.50 SQ
1.35
(RQ-20)
0.069
0.053
10
11
SEATING
PLANE
0.154
BSC
Package Option
RQ-16
RQ-16
CP-16-3
CP-16-3
CP-16-3
RQ-20
RQ-20
0.236
BSC
0.010
0.006
8°
0°
0.050
0.016