24AA04T MICROCHIP [Microchip Technology], 24AA04T Datasheet

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24AA04T

Manufacturer Part Number
24AA04T
Description
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet

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Device Selection Table
Features:
• Single Supply with Operation down to 1.7V for
• Low-Power CMOS Technology:
• 2-Wire Serial Interface, I
• Schmitt Trigger inputs for Noise Suppression
• Output Slope Control to eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 3 ms, typical
• Self-Timed Erase/Write Cycle
• 16-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
• Pb-Free and RoHS Compliant
• Temperature Ranges:
Package Types
© 2009 Microchip Technology Inc.
Note 1:
* 24XX04 is used in this document as a generic part number for the 24LC04/24LC04B devices.
24LC04B
Number
24AA04 Devices, 2.5V for 24LC04B Devices
- Read current 1 mA, typical
- Standby current 1 μA, typical
DFN, TDFN, MSOP and 5-lead SOT-23 or 4-lead
Chip Scale
- Industrial (I):
- Automotive (E): -40°C to +125°C
24AA04
V
Note 1:
Part
A0
A1
A2
SS
PDIP/MSOP/SOIC/TSSOP
2:
1
2
3
4
100 kHz for V
Pins A0, A1 and A2 are not used by the 24XX04. (No internal connections).
Available in I-temp, “AA” only.
Range
1.7-5.5
2.5-5.5
V
CC
-40°C to +85°C
8
7
6
5
CC
2
V
WP
SCL
SDA
C™ Compatible
CC
Max. Clock
<2.5V.
Frequency
400 kHz
400 kHz
4K I
SDA
SCL
Vss
(1)
2
3
1
2
24AA04/24LC04B
SOT-23-5
Ranges
C
Temp.
I, E
I
Serial EEPROM
5
4
WP
Vcc
Description:
The Microchip Technology Inc. 24AA04/24LC04B
(24XX04*) is a 4 Kbit Electrically Erasable PROM. The
device is organized as two blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1 μA and 1 mA,
respectively. The 24XX04 also has a page write
capability for up to 16 bytes of data. The 24XX04 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN, 2x3 TDFN, and MSOP
packages and is also available in the 5-lead SOT-23, or
4-lead Chip Scale package.
Block Diagram
V
SDA
A2
A0
A1
SS
I/O
V
V
Control
Logic
1
2
3
4
CC
SS
I/O
DFN/TDFN
SCL
8
7
6
5
WP
V
WP
SCL
SDA
Control
Memory
CC
Logic
SCL
V
CC
CS (Chip Scale)
Balls Not Visible)
XDEC
(Top Down View,
1
3
DS21708K-page 1
2
4
Sense Amp.
R/W Control
Generator
EEPROM
2
SDA
Latches
V
Array
YDEC
Page
SS
HV

Related parts for 24AA04T

24AA04T Summary of contents

Page 1

... Kbit Electrically Erasable PROM. The device is organized as two blocks of 256 x 8-bit (1) I memory with a 2-wire serial interface. Low-voltage I, E design permits operation down to 1.7V, with standby and active currents of only 1 μA and 1 mA, respectively. The 24XX04 also has a page write capability for bytes of data ...

Page 2

ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied ................................................................................................-40°C to +125°C ESD protection on all pins ...

Page 3

TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Param. Sym. Characteristic No Clock frequency CLK 2 Clock high time T HIGH 3 T Clock low time LOW 4 T SDA and SCL rise time R (Note SDA ...

Page 4

FIGURE 1-1: BUS TIMING DATA 5 3 SCL 7 6 SDA 14 IN SDA OUT FIGURE 1-2: BUS TIMING START/STOP SCL 6 7 SDA Start DS21708K-page Stop © 2009 ...

Page 5

... SS (read/write the entire memory 000-1FF). If tied write operations are inhibited. The entire CC memory will be write-protected. Read operations are not affected. The Chip Scale package does not support the write- protect feature. 2.4 A0, A1, A2 The A0, A1 and A2 pins are not used by the 24XX04. ...

Page 6

FUNCTIONAL DESCRIPTION The 24XX04 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while a device receiving data is defined as a receiver. The bus has ...

Page 7

... The next two bits of the control byte are “don’t cares” for the 24XX04. The last bit, B0, is used by the master device to select which of the two 256-word blocks of memory are to be accessed. This bit is, in effect, the Most Significant bit of the word address. The last bit of the control byte defines the operation to be performed. When set to ‘ ...

Page 8

... But instead of generating a Stop condi- tion the master transmits data bytes to the 24XX04, which are temporarily stored in the on-chip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the four lower-order Address Pointer bits are internally incremented by ‘ ...

Page 9

FIGURE 6-2: PAGE WRITE S T Bus Activity Control A Master Byte R T SDA Line Block Bus Activity Select x = “don’t care” Bits © 2009 Microchip Technology Inc. 24AA04/24LC04B Word ...

Page 10

ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a ...

Page 11

... To provide sequential reads, the 24XX04 contains an internal Address Pointer that is incremented by one upon completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation the 8.4 ...

Page 12

FIGURE 8-2: RANDOM READ S T Bus Activity Control A Master Byte SDA Line Block Select Bus Activity x = “don’t care” FIGURE 8-3: SEQUENTIAL READ Control Bus Activity Byte ...

Page 13

PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead MSOP XXXXXT YWWNNN 5-Lead SOT-23 XXNN 8-Lead 2x3 DFN XXX YWW NN © ...

Page 14

TDFN XXX YWW NN 4-Lead Chip Scale X Part Number TSSOP MSOP 24AA04 4A04 4A04T 24LC04B 4L04 4L4BT Note Temperature grade ( Alphanumeric traceability code Legend: XX...X Part number or part number ...

Page 15

N NOTE © 2009 Microchip Technology Inc. 24AA04/24LC04B DS21708K-page 15 ...

Page 16

N NOTE DS21708K-page φ α c β © 2009 Microchip Technology Inc. ...

Page 17

Microchip Technology Inc. 24AA04/24LC04B DS21708K-page 17 ...

Page 18

D N NOTE DS21708K-page φ L © 2009 Microchip Technology Inc. ...

Page 19

D N NOTE © 2009 Microchip Technology Inc. 24AA04/24LC04B φ L DS21708K-page 19 ...

Page 20

DS21708K-page φ © 2009 Microchip Technology Inc. ...

Page 21

D N NOTE TOP VIEW A3 © 2009 Microchip Technology Inc. 24AA04/24LC04B EXPOSED PAD BOTTOM VIEW A NOTE NOTE DS21708K-page 21 ...

Page 22

DS21708K-page 22 © 2009 Microchip Technology Inc. ...

Page 23

Microchip Technology Inc. 24AA04/24LC04B DS21708K-page 23 ...

Page 24

DS21708K-page 24 © 2009 Microchip Technology Inc. ...

Page 25

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2009 Microchip Technology Inc. 24AA04/24LC04B DS21708K-page 25 ...

Page 26

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21708K-page 26 © 2009 Microchip Technology Inc. ...

Page 27

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging © 2009 Microchip Technology Inc. 24AA04/24LC04B DS21708K-page 27 ...

Page 28

APPENDIX A: REVISION HISTORY Revision C Corrections to Section 1.0, Electrical Characteristics. Revision D Added DFN package. Revision E Revised Figure 3-2 Control Byte Allocation; Figure 4-1 Byte Write; Figure 4-2 Page Write; Section 6.0 Write Protection; Figure 7-1 ...

Page 29

THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web ...

Page 30

READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which ...

Page 31

... C Serial EEPROM 1.7V, SOT-23 package, tape and reel 2 d) 24LC04B-I/P: Industrial Temperature, C Serial EEPROM 2 2.5V, PDIP package C Serial EEPROM 24LC04B-E/SN: Extended Temperature, e) 2.5V, SOIC package f) 24LC04BT-I/OT: Industrial Temperature, 2.5V, SOT-23 package, tape and reel g) 24AA04T-I/CS: 16K Industrial Tempera- ture,1.7V, CS package, tape and reel DS21708K-page31 ...

Page 32

NOTES: DS21708K-page 32 © 2009 Microchip Technology Inc. ...

Page 33

... India. The Company’s quality system processes and procedures are for its PIC MCUs and dsPIC ® devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified ...

Page 34

W ORLDWIDE AMERICAS ASIA/PACIFIC Corporate Office Asia Pacific Office 2355 West Chandler Blvd. Suites 3707-14, 37th Floor Chandler, AZ 85224-6199 Tower 6, The Gateway Tel: 480-792-7200 Harbour City, Kowloon Fax: 480-792-7277 Hong Kong Technical Support: Tel: 852-2401-1200 http://support.microchip.com Fax: 852-2401-3431 ...

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