93AA56B MICROCHIP [Microchip Technology], 93AA56B Datasheet

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93AA56B

Manufacturer Part Number
93AA56B
Description
2K Microwire Compatible Serial EEPROM
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
93AA56B-E/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
93AA56B-I/SN
Manufacturer:
MCP
Quantity:
3 000
Part Number:
93AA56BT-I/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
Device Selection Table
Features:
• Low-power CMOS technology
• ORG pin to select word size for ‘56C’ version
• 256 x 8-bit organization ‘A’ ver. devices (no ORG)
• 128 x 16-bit organization ‘B’ ver. devices (no
• Self-timed erase/write cycles (including
• Automatic ERAL before WRAL
• Power-on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device Status signal (Ready/Busy)
• Sequential read function
• 1,000,000 E/W cycles
• Data retention > 200 years
• Pb-free and RoHS compliant
• Temperature ranges supported:
Pin Function Table
© 2007 Microchip Technology Inc.
93AA56A
93AA56B
93LC56A
93LC56B
93C56A
93C56B
93AA56C
93LC56C
93C56C
CS
CLK
DI
DO
V
NC
ORG
V
ORG)
auto-erase)
SS
CC
Part Number
- Industrial (I)
- Automotive (E)
Name
Chip Select
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
No internal connection
Memory Configuration
Power Supply
2K Microwire Compatible Serial EEPROM
V
CC
1.8-5-5
1.8-5.5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
Range
-40°C to +85°C
-40°C to +125°C
Function
ORG Pin
Yes
Yes
Yes
No
No
No
No
No
No
93AA56A/B/C, 93LC56A/B/C,
Word Size
8 or 16-bit
8 or 16-bit
8 or 16-bit
16-bit
16-bit
16-bit
8-bit
8-bit
8-bit
Description:
The Microchip Technology Inc. 93XX56A/B/C devices
are 2K bit low-voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93AA56C, 93LC56C or 93C56C are dependent
upon external logic levels driving the ORG pin to set
word size. For dedicated 8-bit communication, the
93XX56A devices are available, while the 93XX56B
devices provide dedicated 16-bit communication.
Advanced CMOS technology makes these devices
ideal for low-power, nonvolatile memory applications.
The entire 93XX Series is available in standard
packages including 8-lead PDIP and SOIC, and
advanced packaging including 8-lead MSOP, 6-lead
SOT-23, 8-lead 2x3 DFN and 8-lead TSSOP. All
packages are Pb-free and RoHS compliant.
Temp Ranges
I, E
I, E
I, E
I, E
I, E
I, E
I
I
I
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, OT, MC
P, SN, ST, MS, MC
P, SN, ST, MS, MC
P, SN, ST, MS, MC
93C56A/B/C
Packages
DS21794E-page 1

Related parts for 93AA56B

93AA56B Summary of contents

Page 1

... Microwire Compatible Serial EEPROM Device Selection Table Part Number V Range CC 93AA56A 1.8-5.5 93AA56B 1.8-5-5 93LC56A 2.5-5.5 93LC56B 2.5-5.5 93C56A 4.5-5.5 93C56B 4.5-5.5 93AA56C 1.8-5.5 93LC56C 2.5-5.5 93C56C 4.5-5.5 Features: • Low-power CMOS technology • ORG pin to select word size for ‘56C’ version • 256 x 8-bit organization ‘A’ ver. devices (no ORG) • ...

Page 2

Package Types (not to scale) ROTATED SOIC PDIP/SOIC (ex: 93LC46BX ORG CLK CLK TSSOP/MSOP ...

Page 3

ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................7.0V CC All inputs and outputs w.r.t. V ..........................................................................................................-0. Storage temperature ...............................................................................................................................-65°C to +150°C Ambient temperature with power applied................................................................................................-40°C to +125°C ESD protection on all pins ...

Page 4

TABLE 1-2: AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. Param. Symbol Parameter No Clock frequency CLK A2 T Clock high time CKH A3 T Clock low time CKL A4 T ...

Page 5

FIGURE 1-1: SYNCHRONOUS DATA TIMING CSS CLK DIS (Read (Program) V ...

Page 6

... CS pin. After power-up, the device is automatically in the EWDS mode. Therefore, an EWEN instruction must be performed before the initial ERASE or WRITE instruction can be executed. Block Diagram Address Memory Array Decoder Address Counter Data Register DI Mode Decode ORG* Logic CS ...

Page 7

Erase The ERASE instruction forces all data bits of the speci- fied address to the logical ‘1’ state brought low following the loading of the last address bit. This falling edge of the CS ...

Page 8

... Erase All (ERAL) The Erase All (ERAL) instruction will erase the entire memory array to the logical ‘1’ state. The ERAL cycle is identical to the erase cycle, except for the different opcode. The ERAL cycle is completely self-timed and commences at the falling edge of the CS, except on ‘ ...

Page 9

... The output data bits will toggle on the rising edge of the CLK and are stable after the spec- ified time delay ( held high. The memory data will automatically cycle to the next register and output sequentially. ••• ...

Page 10

Write The WRITE instruction is followed by 8 bits (if ORG is low or A-version devices bits (if ORG pin is high or B-version devices) of data which are written into the specified address. ...

Page 11

... Write All (WRAL) The Write All (WRAL) instruction will write the entire memory array with the data specified in the command. For 93AA56A/B/C and 93LC56A/B/C devices, after the last data bit is clocked into DI, the falling edge of CS initiates the self-timed auto-erase and programming cycle ...

Page 12

... Ready/Busy status from DO. 3.5 Organization (ORG) When the ORG pin is connected to V (x16) memory organization is selected. When the ORG pin is tied to V organization is selected. For proper operation, ORG must be tied to a valid logic level. 93XX56A devices are always x8 organization and 93XX56B devices are always x16 organization ...

Page 13

PACKAGING INFORMATION 4.1 Package Marking Information 8-Lead MSOP (150 mil) XXXXXXT YWWNNN 6-Lead SOT-23 XXNN 8-Lead PDIP XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead 2x3 DFN XXX YWW NN ...

Page 14

... Part Number TSSOP MSOP 93AA56A A56A 3A56AT 93AA56B A56B 3A56BT 93AA56C A56C 3A56CT 93LC56A L56A 3L56AT 93LC56B L56B 3L56BT 93LC56C L56C 3L56CT 93C56A C56A 3C56AT 93C56B C56B 3C56BT 93C56C C56C 3C56CT Note Temperature grade ( Alphanumeric traceability code Legend: XX ...

Page 15

Plastic Micro Small Outline Package (MS or UA) [MSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number ...

Page 16

Plastic Small Outline Transistor (CH or OT) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N PIN LASER MARK ...

Page 17

Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number ...

Page 18

Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number ...

Page 19

Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE ...

Page 20

Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE TOP VIEW ...

Page 21

APPENDIX A: REVISION HISTORY Revision B Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision C Added DFN package. Revision D (11/2006) Updated Package Drawings and Product ID System Revision E (3/2007) ...

Page 22

NOTES: DS21794E-page 22 © 2007 Microchip Technology Inc. ...

Page 23

THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet ...

Page 24

READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways ...

Page 25

... X Device Pinout Tape & Reel Temperature Range Device: 93AA56A: 2K 1.8V Microwire Serial EEPROM 93AA56B: 2K 1.8V Microwire Serial EEPROM 93AA56C: 2K 1.8V Microwire Serial EEPROM w/ORG 93LC56A: 2K 2.5V Microwire Serial EEPROM 93LC56B: 2K 2.5V Microwire Serial EEPROM 93LC56C: 2K 2.5V Microwire Serial EEPROM w/ORG 93C56A: 2K 5.0V Microwire Serial EEPROM 93C56B: 2K 5.0V Microwire Serial EEPROM 93C56C ...

Page 26

NOTES: DS21794E-page 26 © 2007 Microchip Technology Inc. ...

Page 27

... SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. OR AmpLab, FilterLab, Linear Active Thermistor, Migratable INFORMATION, Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are OR registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM ...

Page 28

W ORLDWIDE AMERICAS ASIA/PACIFIC Corporate Office Asia Pacific Office 2355 West Chandler Blvd. Suites 3707-14, 37th Floor Chandler, AZ 85224-6199 Tower 6, The Gateway Tel: 480-792-7200 Habour City, Kowloon Fax: 480-792-7277 Hong Kong Technical Support: Tel: 852-2401-1200 http://support.microchip.com Fax: 852-2401-3431 ...

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