24LCS52-/MC MICROCHIP [Microchip Technology], 24LCS52-/MC Datasheet - Page 19

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24LCS52-/MC

Manufacturer Part Number
24LCS52-/MC
Description
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
© 2005 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MO-187
Drawing No. C04-111
p
B
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
c
n
(F)
Dimension Limits
E1
E
Units
A2
E1
A1
E
D
F
B
n
p
A
L
c
MIN
.030
.000
.016
.003
.009
-
.193 TYP.
2
1
.026 BSC
.118 BSC
.118 BSC
.037 REF
INCHES
NOM
D
L
.033
.024
.006
.012
-
-
-
-
-
8
A
MAX
A1
.043
.037
.006
.009
.016
.031
24AA52/24LCS52
15°
15°
MIN
0.75
0.00
0.40
0.08
0.22
-
MILLIMETERS*
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
-
-
-
-
-
-
-
8
DS21166J-page 19
MAX
1.10
0.95
0.15
0.80
0.23
0.40
15°
15°
A2

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