AT24C1024B-W-11 ATMEL [ATMEL Corporation], AT24C1024B-W-11 Datasheet
AT24C1024B-W-11
Manufacturer Part Number
AT24C1024B-W-11
Description
Two-wire Serial EEPROM 1M (131,072 x 8)
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
1.AT24C1024B-W-11.pdf
(25 pages)
Features
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Description
The AT24C1024B provides 1,048,576 bits of serial electrically erasable and program-
mable read only memory (EEPROM) organized as 131,072 words of 8 bits each. The
device’s cascadable feature allows up to four devices to share a common two-wire
bus. The device is optimized for use in many industrial and commercial applications
where low-power and low-voltage operation are essential. The devices are available
in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP,
8-ball dBGA2 and 8-lead Ultra Thin SAP packages. In addition, the entire family is
available in 1.8V (1.8V to 3.6V) and 2.5V (2.5V to 5.5V) versions.
Low-voltage Operation
Internally Organized 131,072 x 8
Two-wire Serial Interface
Schmitt Triggers, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
400 kHz (1.8V) and 1 MHz (5V, 2.5V) Clock Rate
Write Protect Pin for Hardware and Software Data Protection
256-byte Page Write Mode (Partial Page Writes Allowed)
Random and Sequential Read Modes
Self-timed Write Cycle (5 ms Typical)
High Reliability
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead TSSOP, 8-lead Ultra Thin
Small Array (SAP), and 8-ball dBGA2 Packages
Die Sales: Wafer Form, Tape and Reel and Bumped Die
– 1.8V (V
– 2.5V (V
– Endurance: 1,000,000 Write Cycles/Page
– Data Retention: 40 Years
GND
CC
CC
NC
A1
A2
VCC
= 1.8V to 3.6V)
= 2.5V to 5.5V)
SDA
SCL
WP
8-lead dBGA2
8-lead SOIC
Bottom View
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
NC
A1
A2
GND
VCC
WP
SCL
SDA
GND
GND
NC
A1
A2
8-lead Ultra-Thin SAP
NC
A1
A2
VCC
SDA
SCL
WP
8-lead TSSOP
8-lead PDIP
Bottom View
1
2
3
4
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
8
7
6
5
NC
A1
A2
GND
VCC
WP
SCL
SDA
VCC
WP
SCL
SDA
Two-wire Serial
EEPROM
1M (131,072 x 8)
AT24C1024B
with Two Device
Address Inputs
Rev. 5194F–SEEPR–1/08
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