25LC080C-I/MNY MICROCHIP [Microchip Technology], 25LC080C-I/MNY Datasheet - Page 17

• Manufacturer Part Number: 25LC080C-I/MNY
• Description: 8K SPI Bus Serial EEPROM
• Manufacturer: MICROCHIP [Microchip Technology]

© 2009 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
D
N
A
E
e
L
c
b
A2
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
25XX080C/D
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–
DS22151A-page 17