25LC160C-I/MNY MICROCHIP [Microchip Technology], 25LC160C-I/MNY Datasheet - Page 27

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25LC160C-I/MNY

Manufacturer Part Number
25LC160C-I/MNY
Description
16K SPI Bus Serial EEPROM
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
© 2009 Microchip Technology Inc.
Device:
Tape & Reel:
Temperature
Range:
Package:
Note
PART NO.
Device
1:
“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
Tape & Reel
25AA160C
25AA160D
25LC160C
25LC160D
Blank
T
I
E
MS
P
SN
ST
MNY
(1)
X
=
=
=
=
=
=
=
=
=
16 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM
16 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM
16 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM
16 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM
Standard packaging
Tape & Reel
-40°C to+85°C
-40°C to+125°C
Plastic MSOP (Micro Small Outline), 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
TSSOP, 8-lead
8-lead 2x3 mm TDFN
Temp Range
X
Package
/XX
Examples:
a)
b)
c)
d)
25AA160C-I/MS = 16 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., MSOP
package
25AA160CT-I/SN = 16 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
25LC160DT-I/SN = 16 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
25LC160DT-I/ST = 16 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
TSSOP package
25XX160C/D
.
DS22150A-page 27

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