25LC512-1/MF MICROCHIP [Microchip Technology], 25LC512-1/MF Datasheet - Page 23

• Manufacturer Part Number: 25LC512-1/MF
• Description: 512 Kbit SPI Bus Serial EEPROM
• Manufacturer: MICROCHIP [Microchip Technology]

© 2007 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
Preliminary
A2
E1
E
Units
A2
A1
E1
L1
D
N
A
E
e
h
L
c
b
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
0°
5°
5°
–
25AA512/25LC512
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c
DS22021B-page 23