M24C01-x STMICROELECTRONICS [STMicroelectronics], M24C01-x Datasheet - Page 29

• Manufacturer Part Number: M24C01-x
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24C08-x M24C04-x M24C02-x M24C01-x
Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
3. The circle in the top view of the package indicates the position of pin 1.
Table 19.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Excludes embedding part of exposed die paddle from
D2 (MB)
D2 (MC)
E2 (MC)
Symbol
E2 (MB)
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
measuring.
eee
A1
L1
L3
A
D
E
K
b
e
L
2 x 3 mm, outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
0.550
0.020
0.250
2.000
1.600
3.000
0.200
0.500
Typ
-
-
-
-
-
-
millimeters
1.500
0.100
0.450
0.000
0.200
1.900
1.200
2.900
1.200
0.300
0.300
0.300
0.080
Min
-
Doc ID 5067 Rev 18
0.600
0.050
0.300
2.100
1.700
1.600
3.100
0.300
1.600
0.500
0.150
Max
-
-
-
0.0217
0.0008
0.0098
0.0787
0.0630
0.1181
0.0079
0.0197
Typ
-
-
-
-
-
-
inches
0.0177
0.0000
0.0079
0.0748
0.0591
0.0472
0.1142
0.0039
0.0472
0.0118
0.0118
0.0118
0.0031
Min
-
-
Package mechanical data
(1)
SS
0.0236
0.0020
0.0118
0.0827
0.0669
0.0630
0.1220
0.0118
0.0630
0.0197
0.0059
. It must not be
Max
-
-
-
Note
(2)
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