M24128-BW STMICROELECTRONICS [STMicroelectronics], M24128-BW Datasheet - Page 5

• Manufacturer Part Number: M24128-BW
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

M24128-BW M24128-BR M24128-BF M24128-DF
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
WLCSP connections (top view, marking side, with balls on the underside) . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Maximum R
an I
Maximum R
an I
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 33
SO8N – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 34
UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package outline . . . . . . . 35
M24128-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline . . . . . . . . 36
2
C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
2
C bus at maximum frequency f
C bus at maximum frequency f
bus
bus
value versus bus parasitic capacitance (C
value versus bus parasitic capacitance C
Doc ID 16892 Rev 21
C
C
= 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
= 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
bus
bus
) for
) for
List of figures
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