M95512-D-RCS3G/AB STMICROELECTRONICS [STMicroelectronics], M95512-D-RCS3G/AB Datasheet - Page 41

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M95512-D-RCS3G/AB

Manufacturer Part Number
M95512-D-RCS3G/AB
Description
512 Kbit serial SPI bus EEPROM with high-speed clock
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
M95512-W, M95512-R
Figure 25. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be
Table 21.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Symbol
connected to any other voltage or signal line on the PCB, for example during the soldering process.
ddd
A1
D2
E2
L1
L3
A
D
E
b
e
L
2 × 3 mm, package outline
UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3 .mm, package mechanical data
A
0.55
0.02
0.25
2.00
1.60
3.00
0.20
0.50
0.45
Typ
E
A1
millimeters
Doc ID 11124 Rev 13
0.50
0.00
0.20
1.90
1.50
2.90
0.10
0.40
0.30
Min
D
Max
0.60
0.05
0.30
2.10
1.70
0.08
3.10
0.30
0.50
0.15
ddd
L3
0.0217
0.0008
0.0098
0.0787
0.0630
0.1181
0.0079
0.0197
0.0177
Typ
D2
e
Package mechanical data
b
inches
0.0197
0.0079
0.0748
0.0591
0.1142
0.0039
0.0157
0.0118
UFDFPN-01
Min
0
L1
E2
L
(1)
0.0236
0.0020
0.0118
0.0827
0.0669
0.0031
0.1220
0.0118
0.0197
0.0059
Max
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