NAND01G-M STMICROELECTRONICS [STMicroelectronics], NAND01G-M Datasheet

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NAND01G-M

Manufacturer Part Number
NAND01G-M
Description
256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Features
Flash Memory
August 2006
Multi-Chip Packages
– 1 die of 256 Mb, 512 Mb (x8/ x16) NAND
– 1 die of 256 Mb, 512 Mb (x8/ x16) NAND
– 1 die of 256 Mb, 512 Mb (x8/ x16) NAND
– 1 die of 512 Mb (x16) NAND Flash + 1 die
Supply voltages
– V
– V
Electronic Signature
ECOPACK
Temperature range
– -30 to 85°C
NAND Interface
– x8 or x16 bus width
– Multiplexed Address/ Data
Page size
– x8 device: (512 + 16 spare) Bytes
– x16 device: (256 + 8 spare) Words
Block size
– x8 device: (16K + 512 spare) Bytes
– x16 device: (8K + 256 spare) Words
Page Read/Program
– Random access: 15µs (max)
– Sequential access: 50ns (min)
– Page program time: 200µs (typ)
Copy Back Program mode
– Fast page copy without external buffering
Flash Memories + 256/512Mb (x16/x32, 1.8V) LPSDRAM, MCP
Flash + 1 die of 256 Mb (x16) SDR
LPSDRAM
Flash + 2 dice of 256 Mb (x16) SDR
LPSDRAMs
Flash +1 die of 256 Mb (x16) DDR
LPSDRAM
of 256 Mb or 512 Mb (x16) DDR LPSDRAM
DDF
DDD
= 1.7V to 1.95V or 2.5V to 3.6V
= V
®
DDQD
packages
256/512Mb/1Gb (x8/x16, 1.8/3V, 528 Byte Page) NAND
= 1.7V to 1.9V
Rev 5
NAND512-M, NAND01G-M
LPSDRAM
Fast Block Erase
– Block erase time: 2ms (typ)
Status Register
Data integrity
– 100,000 Program/Erase cycles
– 10 years Data Retention
Interface: x16 or x 32 bus width
Deep Power Down mode
1.8v LVCMOS interface
Quad internal Banks controlled by BA0 and
BA1
Automatic and controlled Precharge
Auto Refresh and Self Refresh
– 8,192 Refresh cycles/64ms
– Programmable Partial Array Self Refresh
– Auto Temperature Compensated Self
Wrap sequence: sequential/interleave
Burst Termination by Burst Stop command and
Precharge command
Refresh
TFBGA137 10.5 x 13 x 1.2 mm
TFBGA107 10.5 x 13 x 1.2mm
TFBGA149 10 x 13.5 x 1.2mm
LFBGA137 10.5 x 13 x 1.4mm
(1) Preliminary specifications.
FBGA
NAND256-M
(1)
www.st.com
1/23
2

Related parts for NAND01G-M

NAND01G-M Summary of contents

Page 1

... Sequential access: 50ns (min) – Page program time: 200µs (typ) Copy Back Program mode – Fast page copy without external buffering August 2006 NAND256-M NAND512-M, NAND01G-M FBGA TFBGA107 10 1.2mm TFBGA149 10 x 13.5 x 1.2mm LFBGA137 10 1.4mm TFBGA137 10 1.2 mm (1) Preliminary specifications ...

Page 2

... SDR (2x16) (2x256Mbit 512Mbit (x8) 3V SDR x16) 1.8V,104Mhz 512 Mbit SDR (2x16 256Mbit 2 x 512Mbit NAND (x8) 3V SDR x16) 1.8V, 104MHz 1 Gbit NAND (x8) 3V 512Mbit SDR (x32) 1.8V, 133MHz NAND256-M, NAND512-M, NAND01G-M LPSDRAM Product Package TFBGA107 TFBGA149 TFBGA149 TFBGA107 TFBGA149 TFBGA149 ...

Page 3

... NAND256-M, NAND512-M, NAND01G-M Contents 1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 NAND Flash Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LPSDRAM Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3 Package Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 Part Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Contents 3/23 ...

Page 4

... TFBGA149 10x13.5mm - 12x16 active ball array, 0.80mm pitch, Mechanical Data Table 8. LFBGA137 10.5x13mm - 10x13 active ball array, 0.8mm pitch- Mechanical Data Table 9. TFBGA137 10.5x13mm - 10x13 active ball array, 0.80mm pitch . . . . . . . . . . . . . . . . . . . . 20 Table 10. Ordering Information Scheme Table 11. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4/23 NAND256-M, NAND512-M, NAND01G-M ...

Page 5

... NAND256-M, NAND512-M, NAND01G-M List of figures Figure 1. Logic Diagram: NAND Flash & SDR LPSDRAM Figure 2. Logic Diagram: NAND Flash & SDR LPSDRAMs Figure 3. Logic Diagram: NAND Flash & DDR LPSDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 4. TFBGA107 Connections (Top view through package Figure 5. TFBGA149 Connections (Top view through package Figure 6 ...

Page 6

... This datasheet should be read in conjunction with the NAND Flash and LPSDRAM datasheets. NAND Flash Component The NAND256-M, NAND512-M and NAND01G-M devices contain a 1.8V, 256 Mbit or 512 Mbit, x8 528 Byte Page or x16 264 Word Page, NAND Flash memory with the Chip Enable Don’t Care option. ...

Page 7

... M65KG512AB: 512Mbit (x16) Double Data Rate (DDR) LPSDRAM one M65KC512AB: 512Mbit (x32) Single Data Rate (SDR) LPSDRAM Refer to Table 1: Product M, NAND256-M and NAND01G-M devices. For detailed information on how to use the SDR LPSDRAM devices, refer to the M65KA256AL and M65KC512AB datasheets which are available from your local STMicroelectronics distributor. ...

Page 8

... CAS DQM0 DQM1 V DDD V DDQD V SSD V SSQD NC 8/23 NAND256-M, NAND512-M, NAND01G-M NAND Flash Data Inputs/Outputs for x8 devices Data Inputs/Outputs for x16 devices Address Latch Enable Command Latch Enable Chip Enable Read Enable Ready/Busy (open-drain output) Write Enable Write Protect Supply Voltage Ground ...

Page 9

... NAND256-M, NAND512-M, NAND01G-M Figure 2. Logic Diagram: NAND Flash & SDR LPSDRAMs DDQD DDD DDF 13 A0-A12 2 I/O0-I/O7, x8/x16 BA0-BA1 I/O8-I/O15, x16 DQ0-DQ15 x16 SDR0 NAND256 NAND512-M AL NAND01G-M DQ16-DQ31 x16 SDR1 RAS CAS V SS Summary description ...

Page 10

... DQM0 DQM1 DQM2 DQM3 V DDD V DDQD V SSD V SSQD NC 10/23 NAND256-M, NAND512-M, NAND01G-M NAND Flash Data Inputs/Outputs Address Latch Enable Command Latch Enable Chip Enable Read Enable Ready/Busy (open-drain output) Write Enable Write Protect Supply Voltage Ground SDR LPSDRAM Row Address: RA0-RA11 Column Address: CA0-CA8 ...

Page 11

... NAND256-M, NAND512-M, NAND01G-M Figure 3. Logic Diagram: NAND Flash & DDR LPSDRAM DDQD DDD DDF 13 A0-A12 2 BA0-BA1 NAND256-M CL NAND512-M WP NAND01G RAS CAS DQM0 DQM1 SSQD SSF SSD Summary description 16 I/O0-I/O15 DQ0-DQ15 UDQS-LDQS RB Ai11023b 11/23 ...

Page 12

... CAS DQM0 DQM1 V DDD V DDQD V SSD V SSQD NC DU 12/23 NAND256-M, NAND512-M, NAND01G-M NAND Flash Data Inputs/Outputs Address Latch Enable Command Latch Enable Chip Enable Read Enable Ready/Busy (open-drain output) Write Enable Write Protect Supply Voltage Ground DDR LPSDRAM Address Inputs A10 determines the Precharge mode. ...

Page 13

... NAND256-M, NAND512-M, NAND01G-M Figure 4. TFBGA107 Connections (Top view through package SSD V DDQD D V SSQD E V DDQD F V SSD G V DDD H V SSQD DDQD L V SSQD DQ11 V DDD DDF V SSF DQ0 ...

Page 14

... DQM0 DQM1 LDQS UDQS DQ0 DQ3 DQ1 DQ6 DQ8 DQ4 DQ2 DQ5 DQ7 DQ9 V DDQD V SSQD V SSD V DDD NAND256-M, NAND512-M, NAND01G DDD V SSD I/ I/O6 I/O15 A6 NC I/O5 I/O14 A5 I/O4 I/O13 I/O12 NC ...

Page 15

... NAND256-M, NAND512-M, NAND01G-M LFBGA137 and TFBGA137 Connections (Top view through package) Figure SSD DDD A12 A11 F NC RAS G V DDD CAS H V SSD BA1 DDD V SSD M I/O0 I/ ...

Page 16

... Dissipation 1. TBD stands for To Be Defined. 2. Minimum Voltage may undershoot to -2V for less than 20ns during transitions on input and I/O pins. Maximum voltage may overshoot to V 16/23 NAND256-M, NAND512-M, NAND01G-M Parameter Ambient Operating Temperature Temperature Under Bias Storage Temperature NAND Flash Input or Output ...

Page 17

... NAND256-M, NAND512-M, NAND01G-M 3 Package Mechanical Figure 7. TFBGA107 10.5x13mm - 10x14 active ball array, 0.80mm pitch, Bottom Outline BALL "B1" Drawing not to scale. Table 6. TFBGA107 10.5x13mm - 10x14 active ball array, 0.80mm pitch, Mechanical Data Symbol Typ 0.80 b 0.45 D 10. ...

Page 18

... millimeters Min Max 1.200 0.250 0.400 0.500 9.900 10.100 0.100 13.400 13.600 – – – – – – NAND256-M, NAND512-M, NAND01G-M b ddd BGA-Z78 inches Typ Min 0.0098 0.0315 0.0177 0.0157 0.3937 0.3898 0.3465 0.5315 0.5276 0.4724 0.0315 – ...

Page 19

... NAND256-M, NAND512-M, NAND01G-M Figure 9. LFBGA137 10.5x13mm - 10x13 active ball array, 0.8mm pitch- Bottom Outline BALL "B1" Subject to change without prior notice. Table 8. LFBGA137 10.5x13mm - 10x13 active ball array, 0.8mm pitch- Mechanical Data millimeters Symbol Typ 1.00 b 0.45 D 10. ...

Page 20

... A 1. Subject to change without prior notice. Table 9. TFBGA137 10.5x13mm - 10x13 active ball array, 0.80mm pitch Symbol Typ 0.80 b 0.45 D 10.50 D1 7.20 E 13.00 E1 11.20 e 0.80 FD 1.65 FE 0.90 SD 0.40 20/23 NAND256-M, NAND512-M, NAND01G millimeters Min Max 1.20 0.25 0.40 0.50 10.40 10.60 12.90 13.10 – – – – ddd A2 BGA-Z83 inches Typ Min 0 ...

Page 21

... NAND256-M, NAND512-M, NAND01G-M 4 Part Numbering Table 10. Ordering Information Scheme Example: Device Type NAND Flash Memory NAND Flash Density 256 = 256Mb 512 = 512Mb 01G = 1Gb Operating Voltage 1.7V to 1.95V DDF 2.5V to 3.6V DDF NAND Bus Width x16 Family Identifier M = 528 Byte Page NAND Flash + LPSDRAM ...

Page 22

... NAND512W3M2 part number added in 4 Figure 5: TFBGA149 Connections (Top view through package) LPSDRAM supply voltage changed to 1.7 to 1.9V. 1 Gbit (x8) 3V NAND Flash memory and 512Mbit SDR (x32) 1.8V, 133MHz LPSDRAM added for NAND01GW3M2. 5 TFBGA137 package added. NAND256-M, NAND512-M, NAND01G-M Revision Details Table 1: Product List. updated. ...

Page 23

... NAND256-M, NAND512-M, NAND01G-M Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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