STK11C68-L SIMTEK [Simtek Corporation], STK11C68-L Datasheet - Page 2

• Manufacturer Part Number: STK11C68-L
• Description: Statement of Material Content Ceramic LCC Packages
• Manufacturer: SIMTEK [Simtek Corporation]

PL0122
Detail
ASSEMBLY MATERIALS
Die Attach
Manufacturer
Die Attach Type
Die Attach Thickness
Die Thickness
Die Coating
Wire Bond Material
Wire Bond Diameter
ASSEMBLY PROCESS FLOW
Flow ID
Wafer Mount
Scribe Method
Saw/Clean
2nd optical
2nd optical QA
Die Attach Method
Die Attach Cure
Bonder: Manual/Auto
Bond Type: Forward/Reverse
Bond Type: At The Die
Bond Type: At The Paddle
3rd Optical
3rd Optical QA
Seal Method/Atmosphere
Lid Seal Temp Profile
Marking Ink
Backside Mark
Ink Cure
Temp Cycle
Centrifuge
Fine Leak
Gross Leak
Final Visual QA
Pack & Ship
PROCESS MONITORS
Wire Bond Monitor
Die Attach Monitor
Lid Seal Monitor
PIND Monitor
Lead Trim Monitor
Seal Area Particulate Monitor
Area Particle Count Limits
Unit
min
min
mil
mil
mil
°C
JMI 7000
Johnson Matthey
Silver Glass
0.5 - 1.0 mil
19 mil
None
Al 99.99%
1.25 mil
P596-0501-0202
Non Contact
Complete Saw Through
CO2 bubbler
High Power. 100%
High Power. 45 C=0
Manual
150-160°C, 10-30 minutes
Automatic
Reverse
Ball
Stitch
Low & High Power. 100%
Low & High Power. 45 C=0
Furnace / Nitrogen
Peak 420+/-5°C
Dwell 7-10 Minutes @ 410°C
Rise 60.5 Min 100-400°C
Cool 2.0-3.5 minutes 400-200°C
Markem 4489 White
[lot #] [assembly country]
150°C+10°C -0°C 1hr +30 -0 minutes
100% 10 cycles, -65°C to +150°C
100% 30KG
100% He 5x10
100% 5torr 0.5H 75psig 1H
100%
45, C=0
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
10,000 In D/A, Wire Bond Areas
28 350 LEADLESS CHIP CARRIER
Simtek Corporation
-8
atm cc/sec
This package type is not available in a lead-free version.
Statement of Material Content
JMI 7000
Johnson Matthey
Silver Glass
0.5 - 1.0 mil
19 mil
None
Al 99.99%
1.25 mil
P596-0501-0202
Non Contact
Complete Saw Through
CO2 bubbler
High Power. 100%
High Power. 45 C=0
Manual
150-160°C, 10-30 minutes
Automatic
Reverse
Ball
Stitch
Low & High Power. 100%
Low & High Power. 45 C=0
Furnace / Nitrogen
Peak 420+/-5°C
Dwell 7-10 Minutes @ 410°C
Rise 60.5 Min 100-400°C
Cool 2.0-3.5 minutes 400-200°C
Markem 4489 White
[lot #] [assembly country]
150°C+10°C -0°C 1hr +30 -0 minutes
100% 10 cycles, -65°C to +150°C
100% 30KG
100% He 5x10
100% 5torr 0.5H 75psig 1H
100%
45, C=0
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
Amkor Procedure
10,000 In D/A, Wire Bond Areas
Ceramic LCC Packages
32 450 LEADLESS CHIP CARRIER
-8
atm cc/sec
STK11C68-L
STK12C68-L
STK14C88-L
August 07