AT17LV010-10DP-MQ ATMEL [ATMEL Corporation], AT17LV010-10DP-MQ Datasheet - Page 7

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AT17LV010-10DP-MQ

Manufacturer Part Number
AT17LV010-10DP-MQ
Description
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1 MEGABIT SERIAL EEPROM, MONOLITHIC SILICON
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
5
PACKAGING
the device.
changes which may affect the performance of the device.
design changes which may affect input or output capacitance. Capacitance shall be measured between the
designated terminal and GND at a frequency of 1 MHz. Sample size is five devices with no failure, and all
input and output terminals tested.
(PAQC0016 referred to MIL-Std-883 method 2018 and 21400 ESCC specification).
4.2
4.3
qualification and technology conformance inspection
• The burn-in test duration, test condition and test temperature, or approved alternatives shall be as
specified in accordance with MIL-PRF-38535.
• Additional screening for space application devices shall be as specified in MIL-PRF-38535, appendix B.
4.4
with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein
for groups A, B, C, D, and E inspections.
4.4.1
• Tests shall be as specified in table 1 herein.
• Subgroups 7 and 8 of table I of method 5005 of MIL STD 883 shall include verifying the functionality of
• O/V (latch up) tests shall be measured only for the initial qualification and after any process or design
• Capacitance measurement shall be measured only for initial qualification and after any process or
4.4.2
4.4.3
4.5
required burn-in screens to determine delta compliance. The electrical parameters to be measured, with
associated delta limits are listed in table 2. The device manufacturer may, at his option, either perform
delta measurements or within 24 hours after life test perform final electrical parameter tests, subgroups 1,
7 and 9.
5.1
The requirements for packaging shall be in accordance with MIL-PRF-38535.
The group C inspection end-point electrical parameters shall be as specified in table 1 herein.
The group D inspection end-point electrical parameters shall be as specified in table 1 herein.
Delta measurements, as specified in table 2, shall be made and recorded before and after the
For space application, Wafer Lot is accepted by a SEM performed according to PAQC0016
Sampling and inspection procedures shall be in accordance with MIL-PRF-38535.
Screening equivalent to MIL-PRF-38535. Screening shall be conducted on all devices prior to
Qualification inspection for high reliability and space applications devices shall be in accordance
Sampling and inspection.
Screening.
Quality conformance inspection
Delta measurements
Packaging requirements
Group A inspection.
Group C inspection.
Group D inspection.
PS-AT17LV010
Sheet 7 / 15
Rev A

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