TZA3019AV PHILIPS [NXP Semiconductors], TZA3019AV Datasheet - Page 25

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TZA3019AV

Manufacturer Part Number
TZA3019AV
Description
2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
Philips Semiconductors
2000 Apr 10
HBCC32: plastic, heatsink bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm
2.5 Gbits/s dual postamplifier with level
detectors and 2
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT560-1
max.
0.80
A
ball A1
index area
0.10
0.05
A
1
e 2
C
B
1
0.70
0.60
A
2
0.35
0.20
IEC
b
32
2 switch
0.50
0.30
b 1
e
D 1
e 1
e 3
0.50
0.35
D
b 2
MO-217
JEDEC
0.50
0.35
b 3
0
REFERENCES
5.1
4.9
D
3.2
3.0
D 1
E 1
E
X
scale
EIAJ
2.5
25
x C
5.1
4.9
e 4
x B
E
E 1
3.2
3.0
0.5
e
5 mm
4.2
e 1
v A
4.2
e 2
detail X
b 2
b 1
A 2
A
4.15
e 3
PROJECTION
EUROPEAN
A 1
4.15
e 4
A
b
w M
w M
y
b 3
Preliminary specification
0.2
v
w M
w M
0.15
w
TZA3019
ISSUE DATE
99-09-10
00-02-01
0.15
x
SOT560-1
0.05
y

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