TZA3047AVH PHILIPS [NXP Semiconductors], TZA3047AVH Datasheet - Page 27

• Manufacturer Part Number: TZA3047AVH
• Description: 30 Mbits/s up to 1.25 Gbits/s laser drivers
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
Product specification
30 Mbits/s up to 1.25 Gbits/s laser drivers
TZA3047A; TZA3047B
Bare die
All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
2003 Jun 05
27