L9386_08 STMICROELECTRONICS [STMicroelectronics], L9386_08 Datasheet - Page 12

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L9386_08

Manufacturer Part Number
L9386_08
Description
Dual intelligent power low side switch
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Package information
3
12/14
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK
packages. ECOPACK
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 8.
(1) “D” dimension does not include mold flash, protusions or gate
DIM.
D
ddd
A1
A
B
C
E
H
e
h
L
k
(1)
burrs. Mold flash, protusions or gate burrs shall not exceed
0.15mm per side.
SO20 mechanical data and package dimensions
12.60
MIN.
2.35
0.10
0.33
0.23
7.40
10.0
0.25
0.40
TYP.
1.27
mm
®
0˚ (min.), 8˚ (max.)
packages are lead-free. The category of second Level Interconnect
MAX.
13.00
10.65
2.65
0.30
0.51
0.32
7.60
0.75
1.27
0.10
0.093
0.004
0.013
0.009
0.496
0.291
0.394
0.010
0.016
MIN.
0.050
inch
TYP.
MAX.
0.104
0.012
0.200
0.013
0.512
0.299
0.419
0.030
0.050
0.004
MECHANICAL DATA
OUTLINE AND
SO20
0016022 D
L9386
®

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