IRU1502-33CH IRF [International Rectifier], IRU1502-33CH Datasheet - Page 9

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IRU1502-33CH

Manufacturer Part Number
IRU1502-33CH
Description
MICROPOWER 1A LOW DROPOUT PMOS VOLTAGE REGULATOR
Manufacturer
IRF [International Rectifier]
Datasheets

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRU1502-33CH
Manufacturer:
HEXAWAVE
Quantity:
5 100
Part Number:
IRU1502-33CH
Manufacturer:
IR
Quantity:
20 000
The thermal pad of MLPM is connected to a 1 inch square
copper through vias for a four layer PCB board design.
From the datasheet, this thermal junction-to-ambient re-
sistance is given as:
For IRU1502-33, the thermal design needs to be con-
sider so that the resultant junction temperature is lower
than the maximum operating temperature, which is 1258C.
Therefore:
Assuming, the following conditions:
Calculate the maximum power dissipation using the fol-
lowing equation:
For MLPM package, we have:
Rev. 1.0
07/17/03
Where:
T
u
T
DT = P
T
V
V
I
P
P
OUT
JA
J
A
J
JA
JC
CH
HA
OUT
IN
D
D
=
= T
= 458C
=428C/W
= 428C/W
= I
= 13(5 - 3.3) = 1.7W
= 5V
= 1A (DC Avg)
= 3.3V
JA
A
2.38C
OUT
38.78C
18C
+DT = 116.48C
D
3P
3u
3(V
D
JA
+T
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
IN
= 1.7342 = 71.4
A
- V
[ 1258C
OUT
)
www.irf.com
Data and specifications subject to change without notice. 02/01
Layout Consideration
The IRU1502-33, like many other high-speed regulators,
requires that the output capacitors be close to the de-
vice for stability. For power consideration, a ground plane
pad of approximately one-inch square on the compo-
nent side must be dedicated to the device where all
ground pins are connected to dissipate the power. If a
multilayer board is used, it is recommended that the
inner layers of the board are also dedicated to the size
of the pad for better thermal characteristics.
Visit us at www.irf.com for sales contact information
TAC Fax: (310) 252-7903
IRU1502-33
9

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