STM32F051X4 STMICROELECTRONICS [STMicroelectronics], STM32F051X4 Datasheet - Page 99
STM32F051X4
Manufacturer Part Number
STM32F051X4
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.STM32F051X4.pdf
(104 pages)
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Package characteristics
7.2
100/105
Figure 38. UFQFPN32 recommended footprint
1. Drawing is not to scale.
2. Dimensions are expressed in millimeters.
Thermal characteristics
The maximum chip junction temperature (T
Table 20: General operating
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
I/O
max represents the maximum power dissipation on output pins where:
T
Θ
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in °C/W,
max = Σ (V
max is the product of I
OL
× I
OL
INT
T
) + Σ((V
conditions.
J
Doc ID 022265 Rev 3
max = T
OL
max and P
DD
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
/ I
OH
D
OH
),
max x Θ
D
of the I/Os at low and high level in the
max = P
JA
)
INT
max + P
I/O
max),
STM32F051x
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