STR91XFA STMICROELECTRONICS [STMicroelectronics], STR91XFA Datasheet - Page 73

• Manufacturer Part Number: STR91XFA
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STR91xFA
Figure 29. 144-Low Profile Fine Pitch Ball Grid Array Package
Figure 30. Recommended PCB Design rules (0.80/0.75mm pitch BGA)
Dpad
Dsm
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
Dim.
ddd
eee
A1
A2
D1
E1
fff
A
D
E
N
b
e
F
1
Values in inches are converted from mm
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
1.21
0.21
0.35
9.85
9.85
Min
and rounded to 4 decimal digits.
1.085
10.00 10.15 0.3878 0.3937 0.3996
10.00 10.15 0.3878 0.3937 0.3996
0.40
8.80
8.80
0.80
0.60
mm
Typ
Number of Pins
Max
1.70 0.0476
0.45 0.0138 0.0157 0.0177
0.10
0.15
0.08
Package mechanical data
144
0.0083
Min
inches
0.0427
0.3465
0.3465
0.0315
0.0236
Typ
1)
0.0669
0.0039
0.0059
0.0031
Max
73/78