STR750FXX STMICROELECTRONICS [STMicroelectronics], STR750FXX Datasheet - Page 77

• Manufacturer Part Number: STR750FXX
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Figure 47. 64-Low Profile Fine Pitch Ball Grid Array Package
Figure 48. 100-Low Profile Fine Pitch Ball Grid Array Package
Figure 49. Recommended PCB design rules (0.80/0.75mm pitch BGA)
Dpad
Dsm
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
Dim.
Dim.
ddd
ddd
eee
A1
A2
D1
E1
A1
A2
A3
A4
D1
E1
fff
A
D
E
N
A
D
E
N
b
e
b
e
F
f
1.210
0.270
0.450 0.500 0.550 0.018 0.020 0.022
7.750 8.000 8.150 0.305 0.315 0.321
7.750 8.000 8.150 0.305 0.315 0.321
0.720 0.800 0.880 0.028 0.031 0.035
1.050 1.200 1.350 0.041 0.047 0.053
0.270
0.45 0.50 0.55 0.018 0.020 0.022
9.85 10.00 10.15 0.388 0.394 0.40
9.85 10.00 10.15 0.388 0.394 0.40
Min
Min
Package characteristics
1.120
5.600
5.600
1.085
0.30
7.20
7.20
0.80
1.40
mm
Typ
mm
Typ
Number of Balls
Number of Pins
1.700 0.048
0.120
1.700
Max
Max
0.80
0.12
0.15
0.08
100
64
0.011
0.011
Min
Min
inches
inches
0.044
0.220
0.220
0.043
0.012
0.283
0.283
0.031
0.055
Typ
Typ
0.067
0.005
0.067
0.031
0.005
0.006
0.003
Max
Max
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