LT1815 LINER [Linear Technology], LT1815 Datasheet - Page 17

• Manufacturer Part Number: LT1815
• Description: Single/Dual/Quad 220MHz, 1500V/us Operational Amplifiers with Programmable Supply Current
• Manufacturer: LINER [Linear Technology]

PACKAGE DESCRIPTIO
3.5 0.05
2.15 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
0.28
0.05
(.0165 .0015)
2.38 0.05
0.42 0.04
(2 SIDES)
GAUGE PLANE
(.077)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
TYP
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(.206)
0.50
BSC
5.23
MIN
U
(.010)
0.254
0.675 0.05
PACKAGE
OUTLINE
DETAIL “A”
8-Lead Plastic DFN (3mm 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1660)
DETAIL “A”
TOP MARK
0 – 6 TYP
(.0256)
0.889 0.127
(.035 .005)
(.126 – .136)
0.65
BSC
8-Lead Plastic MSOP
3.2 – 3.45
PIN 1
0.200 REF
(.021 .006)
0.53 0.015
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
MS8 Package
DD Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
SEATING
PLANE
(1.93 .006)
3.00 0.102
(.118 .004)
4.90 0.15
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
3.00 0.10
0.75 0.05
(4 SIDES)
(.0256)
0.65
BSC
1
8
0.00 – 0.05
7 6 5
2 3
4
1.65
(2 SIDES)
(.118 .004)
3.00 0.102
(.206)
(.034)
0.52
REF
NOTE 4
0.86
REF
(.005 .003)
0.13 0.076
MSOP (MS8) 0802
0.10
BOTTOM VIEW—EXPOSED PAD
0.28
R = 0.115
TYP
4
0.05
5
LT1816/LT1817
2.38 0.10
(2 SIDES)
8
1
0.50 BSC
0.38
(DD8) DFN 0203
0.10
LT1815
17
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