PA75 APEX [Cirrus Logic], PA75 Datasheet - Page 4

• Manufacturer Part Number: PA75
• Description: DUAL POWER OPERATIONAL AMPLIFIERS
• Manufacturer: APEX [Cirrus Logic]

PA75
GENERAL
ations” which covers stability, supplies, heatsinking, mounting,
SOA interpretation, and specification interpretation. Visit www.
apexmicrotech.com for design tools that help automate tasks
such as calculations for stability, internal power dissipation,
heatsink selection; Apex’s complete Application Notes library;
Technical Seminar Workbook; and Evaluation Kits.
STABILITY CONSIDERATIONS
that present special stability problems. This is primarily due to
non-complementary (both devices are NPN) output stages with
a mismatch in gain and phase response for different polarities
of output current. It is difficult for the op amp manufacturer to
optimize compensation for all operating conditions.
SAFE OPERATING AREA (SOA)
op amp. For a given application, the direction and magnitude
of the output current should be calculated or measured and
checked against the SOA curves. This is simple for resistive
loads but more complex for reactive and EMF generating
loads.
THERMAL CONSIDERATIONS
tab to which the monolithic is directly attached. The PA75CD
and CX may require a thermal washer, which is electrically
insulating since the tab is directly tied to -VS. This can result
in a thermal impedance RCS of up to 1˚C/W or greater.
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: [phone]
4
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
Please read Application Note 1 “General Operating Consider-
All monolithic power op amps use output stage topologies
The SOA curves combine the effect of all limits for this power
The PA75CD and CX have a large exposed copper heat
PA75U REV D MARCH 2006 © 2006 Apex Microtechnology Corp.
to which the monolithic is directly attached. The solder connec-
tion of the heatslug to a minimum of 1 square inch foil area of
the printed circuit board will result in thermal performance of
25°C/W junction to air rating of the PA75CC. Solder connec-
tion to an area of 1 to 2 square inches of foil is required for
minimal power applications
it is necessary to use surface mount techniques of heatsink-
ing. Surface mount techniques include the use of a surface
mount fan in combination with a surface mount heatsink on
the backside of the FR4/ PC board with through hole thermal
vias. Other highly thermal conductive substrate board materials
are available for maximum heat sinking.
MOUNTING PRECAUTIONS
1. Always use a heat sink. Even unloaded the PA75 can dis-
2. Avoid bending the leads. Such action can lead to internal
3. Always fasten the tab of the CD and CX package to the heat
4. Strain relief must be provided if there is any probability of
The PA75CC has a large exposed integrated copper heatslug
Where the PA75CC is used in higher power applications,
sipate up to .4 watts.
damage.
sink before the leads are soldered to fixed terminals.
axial stress to the leads.
CONSIDERATIONS
OPERATING