HSDL-1100 Agilent(Hewlett-Packard), HSDL-1100 Datasheet - Page 3

• Manufacturer Part Number: HSDL-1100
• Description: General Application Guide for the HSDL-1100 4 Mb/s Infrared Transceiver
• Manufacturer: Agilent(Hewlett-Packard)

amplifier for both receiver chan-
nels contains daylight cancellation
circuitry to eliminate the ambient
light portion of incoming Ir signals.
Lead Bend Options
Lead bend options for the HSDL-
1100 include the TOP (#X08
option), and FRONT (#X07 option).
The TOP and FRONT options are
similar to that shown on page 13 of
the Hewlett-Packard IrDA Design
Guide, and are shown in detail on
the HSDL-1100 datasheet. The TOP
option lies flat on the circuit board,
while the FRONT stands upright on
the circuit board.
Implementation of the
HSDL-1100
Required External Components
Table 2 describes the external
Table 2.
Component
R1
RLED (R2)
R3
CX1
CX2
CX3
CX4
CX5
CX6
CX7
Description
Txd input resistor for transmitter peaking.
LED bias resistor which sets LED current pulse
amplitude.
Power supply noise filter resistor. The higher the
value, the lower the minimum filter frequency.
1/(R3•CX5) is the minimum filter frequency.
PIN bypass capacitor to reduce noise at the PIN
detector.
Txd input capacitor for transmitter peaking.
Adaptive threshold capacitor.
Adaptive threshold averaging capacitor.
V
0.5 cm of module pins 2,4.
V
V
CC
CC
CC
to Gnd bypass capacitor. Should be within
to Gnd bypass capacitor.
transmitter bypass capacitor
components required for obtaining
datasheet performance (Actual
values for the components may
vary with the I/O chip, controller
chip, EnDec chip, or buffer chip
that the HSDL-1100 interfaces to).
Board Layout Requirements
Proper board layout is crucial to
the noise immunity of the overall Ir
system. Compromised board
layout may lead to reduced
sesitivity, and therefore shorter
achievable Ir link distance. Proper
board layout is descibed in detail
in page 16 of the Hewlett-Packard
IrDA Design Guide.
Keys aspects of proper board
layout are:
• V
CX5 should be placed within
0.5 cm of the HSDL-1100
CC
to Gnd bypass capacitor
Recommended Value
560
4.7
Drive Requirements Section)
10-50
0.47 F, 10%, X7R ceramic, <0.5 cm
from pin 1.
220 pF, 10%, X7R ceramic
1000 pF, 10%, X7R ceramic
0.010 F, 10%, X7R ceramic
0.47 F, 20%, X7R ceramic, <0.5 cm
lead length, within 0.5 cm from pins
2, 4.
6.8 F, Tantalum. Larger value
recommended for noisy supplies
or environments.
0.47 F, ceramic. Used to eliminate
ripple on V
current during infrared transmission.
• The PIN bypass capacitor
• A multi-layer PC board
• The board underneath and
module pins 2,4, AND on the
same side of the PC board as
the HSDL-1100 module.
CX1 should be <0.5 cm from
pin 1 of the HSDL-1100
module.
should be used, and one
layer devoted to a ground
plane for the HSDL-1100
module. The ground plane
should be laid out as an
island, with one connection
to a clean (<20 mV noise)
system ground or analog
system ground, and sepa-
rated from the ground
connection of fast switching
devices, or noise sources.
1 cm in any direction around
the module is defined as the
5%, 0.5 watt (See Transmitter
5%, 0.125 watt
5%, 0.125 watt
CC
caused by the LED