HCPL7840 Agilent(Hewlett-Packard), HCPL7840 Datasheet - Page 3

• Manufacturer Part Number: HCPL7840
• Description: Analog Isolation Amplifier
• Manufacturer: Agilent(Hewlett-Packard)

1-250
Maximum Solder Reflow Thermal Profile
Insulation and Safety Related Specifications
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Storage Temperature
Ambient Operating Temperature
Supply Voltages
Steady-State Input Voltage
2 Second Transient Input Voltage
Output Voltages
Lead Solder Temperature
(10 sec., 1.6 mm below seating plane)
Solder Reflow Temperature Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)
Parameter
1
T = 115°C, 0.3°C/SEC
2
Parameter
T = 100°C, 1.5°C/SEC
3
4
TIME – MINUTES
5
Symbol
L(IO1)
L(IO2)
6
CTI
7
8
Value Units
0.08
200
IIIa
V
7.1
7.4
V
OUT+
V
Symbol
DD1
9
IN+
See Maximum Solder Reflow Thermal Profile Section
T
T = 145°C, 1°C/SEC
T
T
, V
LS
, V
, V
A
S
10
Volts
DD2
mm
mm
mm
IN-
OUT-
11
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
12
Min.
-2.0
-6.0
-0.5
-55
-40
0.0
Regulatory Information
The HCPL-7840 has been
approved by the following
organizations:
UL Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA Approved under CSA
Component Acceptance Notice
#5, File CA 88324.
V
V
DD1
DD2
Max.
Conditions
125
260
5.5
85
+0.5
+0.5
Unit
V
V
V
C
C
C
Note
1