ADG408 Analog Devices, ADG408 Datasheet - Page 4

• Manufacturer Part Number: ADG408
• Description: LC2MOS 4-/8-Channel High Performance Analog Multiplexers
• Manufacturer: Analog Devices

ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog, Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
Operating Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at A, EN, S or D will be clamped by internal diodes. Current should
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
be limited to the maximum ratings given.
DD
DD
SS
A
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Industrial (B Version) . . . . . . . . . . . . . . . . . –40 C to +85 C
Extended (T Version) . . . . . . . . . . . . . . . . –55 C to +125 C
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300 C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260 C
Lead Temperature, Soldering
= +25 C unless otherwise noted)
JA
JA
JA
JC
JA
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77 C/W
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
2
. . . . . V
SS
–2 V to V
1
Whichever Occurs First
DD
+2 V or 20 mA,
–4–
Model
ADG408BN
ADG408BR
ADG408BRU
ADG408TQ
ADG409BN
ADG409BR
ADG409TQ
NOTES
1
2
To order MIL-STD-883, Class B processed parts, add /883B to T grade part
N = Plastic DIP; Q = Cerdip; R = 0.15" Small Outline IC (SOIC);
numbers.
RU = Think Shrink Small Outline Package (TSSOP).
1
ORDERING INFORMATION
Temperature Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
–40 C to +85 C
–40 C to +85 C
–55 C to +125 C
WARNING!
ESD SENSITIVE DEVICE
Package Option
N-16
R-16A
RU-16
Q-16
N-16
R-16A
Q-16
REV. A
2