M27C4002-12XJ1TR STMicroelectronics, M27C4002-12XJ1TR Datasheet - Page 4

• Manufacturer Part Number: M27C4002-12XJ1TR
• Description: 4 Mbit 256Kb x16 UV EPROM and OTP EPROM
• Manufacturer: STMicroelectronics

M27C4002
Table 5. AC Measurement Conditions
Figure 3. AC Testing Input Output Waveform
Table 6. Capacitance
Note: 1. Sampled only, not 100% tested.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require careful decoupling of the
devices. The supply current, I
ments that are of interest to the system designer:
the standby current level, the active current level,
and transient current peaks that are produced by
the falling and rising edges of E. The magnitude of
the transient current peaks is dependent on the
output capacitive and inductive loading of the de-
vice.
The associated transient voltage peaks can be
suppressed by complying with the two line output
4/16
Input Rise and Fall Times
Input Pulse Voltages
Input and Output Timing Ref. Voltages
High Speed
Standard
Symbol
2.4V
0.4V
C
3V
0V
C
OUT
IN
Input Capacitance
Output Capacitance
(1)
Parameter
(T
A
= 25 C, f = 1 MHz )
CC
, has three seg-
1.5V
2.0V
0.8V
AI01822
High Speed
Test Condition
0 to 3V
V
1.5V
V
10ns
OUT
IN
Figure 4. AC Testing Load Circuit
control and by properly selected decoupling ca-
pacitors. It is recommended that a 0.1 F ceramic
capacitor be used on every device between V
and V
of low inherent inductance and should be placed
as close to the device as possible. In addition, a
4.7 F bulk electrolytic capacitor should be used
between V
bulk capacitor should be located near the power
supply connection point.The purpose of the bulk
capacitor is to overcome the voltage drop caused
by the inductive effects of PCB traces.
= 0V
= 0V
C L = 30pF for High Speed
C L = 100pF for Standard
C L includes JIG capacitance
DEVICE
SS
UNDER
TEST
. This should be a high frequency capacitor
CC
and V
Min
SS
1.3V
for every eight devices. The
1N914
3.3k
0.4V to 2.4V
0.8V and 2V
C L
Standard
Max
12
6
20ns
OUT
AI01823B
Unit
pF
pF
CC