PA2423L-EV SiGe Semiconductor Inc., PA2423L-EV Datasheet - Page 8
PA2423L-EV
Manufacturer Part Number
PA2423L-EV
Description
2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information
Manufacturer
SiGe Semiconductor Inc.
Datasheet
1.PA2423L-EV.pdf
(11 pages)
PA2423L
2.4 GHz Bluetooth Class 1 Power Amplifier IC
Preliminary Information
Package Dimensions
The PA2423L is packaged in a 1.6 mm x 3.0 mm 6 lead LPCC package. The underside of the package is an exposed die-pad structure. This allows for
direct soldering to the PCB for enhanced thermal conductivity. The package dimensions are shown in the drawing below.
DOC# 05PDS002 Rev 4
07/26/2001
Page 8 of 11
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